Electronics Forum | Wed Feb 15 17:16:54 EST 2012 | davef
To get started look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=61862 On your lingering disbelief of your suppliers truthfulness in the C of C: Periodic auditing of their truthfulness by your QA peeps or a third party is an acce
Electronics Forum | Wed Jul 04 13:25:03 EDT 2012 | davef
Baking boards to remove moisture takes a lot more energy than you'd think. Following on with this, Chris Hunt from NPL gave a presentation at IPC APEX 2012 about the results of his research ["Impedance Testing for Sensitivity to Delamination in Print
Electronics Forum | Tue Nov 13 10:29:55 EST 2012 | 15009
I am looking for opinions on how much larger soldermask pads should be versus the copper. I am aware that some pcb manufacturers can hold tighter tolerances than others but is there an IPC recommendation? Some shops we deal with can hold .002 per sid
Electronics Forum | Sat Nov 17 19:51:23 EST 2012 | cadco
aybars, Mouser is supposed to have 113 of these on Monday the 19 Nov 2012. I would advise you to call them and reserve them first thing on Monday before someone else does, those are all that I can find at the moment, I will make some other inquiries
Electronics Forum | Fri Dec 10 02:26:16 EST 1999 | Tracy Guo
Hi, I'm facing smear after printing on DEK288 using reverse squeegee at the edge of panels. I've checked the fixture, printing parameter, stencil, solder paste. What else can I do?
Electronics Forum | Fri Dec 10 12:06:35 EST 1999 | Gary Kemp
Tracy, I would check the squeegee blade for wear at the edges. Also, check the squeegee pressure to ensure it is not to high, forcing the paste between the stencil and the land, causing a smear. Good luck.
Electronics Forum | Thu Dec 16 06:06:52 EST 1999 | Stefan
Check the print gap and check the clamp edges, sometimes the clamps is damaged causing a distance between the PCB and the screen. Good luck
Electronics Forum | Wed Jun 27 09:15:21 EDT 2007 | gregf912
The program that I use is the Fuji calibration program and it works fine on all other equipment that I use it on. The PDs are dialed in at 10% tolerance and the nozzles are new. I see it more on 105 and 1608 parts but it happens on 2012 and 3216 part
Electronics Forum | Fri Nov 23 07:51:25 EST 2007 | shy
Hi there, kindly help to advice me either epoxy/glue at bottom SMT component such as chip package 2012 will cause the component to be non-wetting after run reflow process?
Electronics Forum | Sun Nov 25 20:36:15 EST 2007 | shy
Hi Devaf, Sorry to make unclear statement earlier. I believe the issue that i'm trying to discuss is regarding the adhesive that place beneath (center) the component to prevent it from drop during wave soldering process. Normally the component pack
