Siemens SIPLACE X3S+SX2 (+WPC) Pick and place Machine Siemens SIPLACE X3S+SX2 (+WPC) Pick and place Machine Patch speed: 160000CPH Mounting accuracy: 22 microns Feeder capacity: 250 8mm + 28 layer automatic Ic feeder Product description: Sieme
Siemens Mounter SIPLACE X3S SX2 High Speed Mounter Siemens Pick and Place Machine Patch speed: 160000CPH Siemens Mounter SIPLACE X3S SX2 High Speed Mounter Product description: Siemens Mounter SIPLACE X3S SX2 High Speed Mounter INQUIR
Electronics Forum | Tue Jan 21 18:44:00 EST 2020 | victor
Hello, Could you please help with getting the Station Computer installation manual for 4XXX and 5XXX station software versions? Cheers, Victor
Parts & Supplies | Circuit Board Assembly Products
N510025620AA Pressure Senor W/CONNECTOR MPS V6T-AG-0.26M-KM-RH Machine DT401 01FDC081121 Pressure Sensor KXF0DQXA00 Connector MPS V6T-AG-0.26M-KM-RH KXFY1544A00 Pressure Senor W/CONNECTOR Panasonic KME CM212-M(NM-EJM6A) Modular Placement Ma
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Parts & Supplies | SMT Equipment
00353446S04 Servo Amplifier SDS60/1.0Z1-01 00353447S03 Servo Amplifier SDS60/0,5D1 00353448S02 DYNAMIC BRAKE DBM/3P/3-01 00353449S03 DC/DC-Converter 5V / 15V 00353450S02 DC/DC-Converter +/- 15V 00353481-04 LOAD ADD CIRCUIT LSZ250/1000 00353483
Technical Library | 2020-01-15 23:54:34.0
Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics.
Technical Library | 2011-11-03 18:04:07.0
This paper presents the development of a novel vehicle-routing-based algorithm for optimizing component pick-up and placement on a collect-and-place type machine in printed circuit board manufacturing. We present a two-phase heuristic that produces soluti
