Electronics Forum: 20mark and blisters (Page 1 of 2)

Flexi boards and uBGA

Electronics Forum | Tue Jul 11 10:13:22 EDT 2006 | SWAG

Over time, you might see problems with delam., blistering and warpage if using FR4 carriers. Depending on volumes, you might consider using durostone or some robust material like that for the production runs. Keep in mind that switching materials w

Blistering and delaminating boards

Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1

Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di

Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Jan 25 18:15:39 EST 1999 | Joe

Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and re-packed

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Sun Aug 17 19:06:42 EDT 2014 | natashakt

Hi All, I have been looking in to some failures of PCB's in Assembly. After SMT the boards are stored for different periods of time in high humity environment (72% RH and 21.4 degrees Celsius) before being sent to Assembly to be handsoldered/put thr

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Thu Sep 04 03:26:18 EDT 2014 | eurekadrytech

Hi all: Interesting question you have raised as it concerns the rate of absorption by the board material. I represent http://www.EurekaDrytech.com and could assist in resolving the blistering problems you're facing. First some questions. 1. Is the

Contamination/process issues of SMT and wave soldered pcb's

Electronics Forum | Thu Jul 03 08:40:23 EDT 2003 | Kris

Hi, undercured solder resists may be a defect people have seen so far. Some of the probles arising is blistering as well as reaction with wave solder flux that may lead to some kind bad gel like formations. Gels the idea would be to reflow the ba

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Thu Aug 21 16:00:31 EDT 2014 | davef

This links to a NPL presentation on moisture removal from PCB http://www.npl.co.uk/upload/pdf/20140318_effect_baking.pdf Consider: * Focusing on preventing moisture contamination of boards, rather than removing moisture * There will be no standard

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Sun Sep 07 20:51:52 EDT 2014 | natashakt

1. Is the high RH environment consistently at 72% RH and 21.4 degrees Celsius? No, over the past 2 weeks I have recorded the highest at the moment: 67% RH at 22.6 degrees C and lowest (it is Spring not summer yet): 31.9% RH at 19.0 degrees C. Or d

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