Electronics Forum | Sun Apr 15 23:12:00 EDT 2001 | Eric Chua
The size i had changed from 55 x 20 mils to 42 x 20 mils. The component size i have is 40 x 20 mils ( 1mm x 0.5mm ).
Electronics Forum | Fri Aug 13 12:52:17 EDT 1999 | Steve Schrader
| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi
Electronics Forum | Fri Oct 22 06:19:42 EDT 1999 | TNT
Ron, if I am reading this correctly the 20mil parts are not having problems on a 6mil stencil. If you increase the entire thickness of the stencil to 8mils, there should not be any issues with the 20mil components. The supports you are using could p
Electronics Forum | Wed Mar 10 08:20:00 EST 2010 | aajmera
I am sorry, they are fine-pitch QFPs (20 mils)
Electronics Forum | Thu Aug 12 18:43:49 EDT 1999 | Wayne S.
Hello Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening 100 durometer blade. Getting "tails" on deposits. Trie
Electronics Forum | Thu Aug 12 20:17:12 EDT 1999 | Kelly Morris
| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi
Electronics Forum | Fri Jan 08 16:31:05 EST 1999 | Jason Tomlinson
Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what acti
Electronics Forum | Tue Feb 23 09:51:35 EST 1999 | Steve Schrader
| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with
Electronics Forum | Thu Oct 21 14:02:32 EDT 1999 | Ron Costa
We are a contract manufacturer currently building a job with IBM CBGA-255 devices and 20mil QFP's that are close to each other. We use a 6 mil laser cut and electro polished stencil with one to one apertures on the BGA's. The customer is experiencing
Electronics Forum | Tue Mar 19 00:14:47 EST 2002 | ianchan
Hi Guys, Can anyone help us out here, please? We need to know what formulae (other than Length(L)xBreath(B)xheight(Z)), is used to determine what volume of paste is required for 20mils pitch leadless chip carrier (LCC28), for the paste printing pro
