Used SMT Equipment | Pick and Place/Feeders
The JUKI high-speed placement machine FX-1R is compatible with the linear motor used in high-speed placement and the unique HI-Drive mechanism. It inherits the traditional concept of a modular placement machine and realizes a high-speed placement m
Used SMT Equipment | Pick and Place/Feeders
JUKI Chip Mounter – KE 2050M The best system for high-speed placement of small components. As part of a “modular concept”, the KE-2050 can be the base of a flexible placement system line designed specifically to meet the require
_1.jpg)
Used SMT Equipment | Pick and Place/Feeders
Buy affordable section JUKI FX-1/FX-1R Model number: FX-1/FX-1R Year: 2005-2009 Mounting head: Laser head × 2 (8 nozzles) Station: 80 Board size: M substrate 50*30-330*250MM L substrate 50*30-410*360MM E substrate 50*30-510*460MM Mounting sp
Used SMT Equipment | Pick and Place/Feeders
Type name high-speed veneer KE-2070M / KE -2070L / KE -2070E Substrate size M substrate(330 X 250mm) ○ L substrate(410 X 360mm) ○ E substrate(510 X 460mm) ○ Component height 6mm specification ○ 12Mm specification ○ 20Mm specification _ 25Mm sp
Used SMT Equipment | Pick and Place/Feeders
XPF-S/L Multifunctional Universal Machine • Mounting speed: rotating automatic head replacement: 0.144sec/ 25000cph
Used SMT Equipment | Pick and Place/Feeders
JUKI Mounter fx-1r parameters: Board size: 410*360mm Component height: 6mm 33,000CPH：chip (optimal) / 25,000CPH: chip (IPC 9850) Two independent multi-nozzle laser heads (8 total nozzles) from 0603 （0201） to 20mm square components or 26.5×
Used SMT Equipment | SMT Equipment
The KE-2050 is typically used as a compliment to the KE-2060 to increase overall throughput by placing the higher volume small chip components SOTs and ICs. ■ 13,200CPH：chip (laser centering/effective tact) ■ One multi-nozzle laser head (4 n
Used SMT Equipment | SMT Equipment
The High-speed Modular Mounter FX-1R is a traditional modular chip shooter driven at extreme speeds. Refinements in the drive system deliver real world improvements in actual throughput. ■ 33,000CPH：chip (optimal) / 25,000CPH: chip (IPC 9850) ■
Used SMT Equipment | Chipshooters / Chip Mounters
The KE-2010 is typically used as a compliment to the KE-2020 to increase overall throughput by placing the higher volume small chip components SOTs and ICs. ■ 10,000CPH：chip (laser centering/effective tact) ■ One multi-nozzle
Used SMT Equipment | Chipshooters / Chip Mounters
The KE-2050 is typically used as a compliment to the KE-2060 to increase overall throughput by placing the higher volume small chip components SOTs and ICs. ■ 13,200CPH：chip (laser centering/effective tact) ■ One multi-nozzle
