Electronics Forum: 220c (Page 1 of 9)

Pb free BGA voids

Electronics Forum | Tue May 02 07:56:58 EDT 2006 | billyd

Yeah, that's what I'm doing now. I have it now peaking around 235, with about 70 sec. above 220C. (220C is the reflow temp, according to manufacturer. I've always used 217C for Pb free) Wish me luck. Thanks!

QFP144 soldering problem

Electronics Forum | Mon Sep 10 15:49:28 EDT 2007 | mun4o

Hi, the solder on the pad is not molt.Temperature of the leads is about 220*C( I change this T from 214 to 232) but result is same - solder is granular and not diffuse.I think the T on leads is not enough high,bu I can't increase because the max T on

SAC305 Lead Frame Component with Leaded Process?

Electronics Forum | Tue Sep 16 09:25:49 EDT 2008 | trynders

I had a vendor change thier lead finish from tin/lead to a SAC305. We built up several assemblies before we realized the change. The reflow process is a standard leaded profile peaking at 220 C. What are the reliablity concerns with mixing the tin/l

reflow oven

Electronics Forum | Mon May 24 17:32:18 EDT 2004 | pjc

Look to the no-Pb solderpaste mfr. specs for on-board temps. For example, Indium Corp. has a product that performs at on-board temps of 229C. Now, your BTU oven will handle this no problem, as will most modern ovens. Its all about thermal mass. Look

reflow / soldering temperature

Electronics Forum | Mon Apr 09 14:05:25 EDT 2001 | slthomas

CAL's word of caution is right on. We tend to stay in the 220C-225C max. temp. on our profiles, and that's because the last heads up from engineering came on a part with a spec. of 230C max. temp. We just found out that one of our old SOIC's is spe

Reflow Profiling

Electronics Forum | Tue Oct 26 13:45:19 EDT 2004 | vinod

Hi friends I am using Alpha Metal WS709 solder paste. I know the spec for this solder paste. It recommends straight ramp to 220 C at 0.9 degree/sec and TAL 75 sec.So I am looking between around 27-220 temp around 215 second. And time above 183 not to

Reflow Profiling

Electronics Forum | Tue Oct 26 13:45:23 EDT 2004 | vinod

Hi friends I am using Alpha Metal WS709 solder paste. I know the spec for this solder paste. It recommends straight ramp to 220 C at 0.9 degree/sec and TAL 75 sec.So I am looking between around 27-220 temp around 215 second. And time above 183 not to

BGA ball Separation

Electronics Forum | Mon Dec 05 12:57:59 EST 2005 | Billy D

Dude, make sure you're not getting too hot, too quick. If the BGA "dogears" in the oven, or during a rework procedure, it'll either short, or get very strained, depending on which way the part moves, up or down. Also, bake the hell out of them, as if

CSP and underfill

Electronics Forum | Fri Aug 23 18:51:00 EDT 2002 | edahi

weve done a few evaluations for the no-flow underfill and for the reliability I think it has already passed MRT L3 @ 220C reflow. What is it specifically you're interested about the flow u/fill??

Soldering problem with SMT Header

Electronics Forum | Tue Dec 02 08:51:31 EST 2003 | Daniel Werkhoven

Dear Frank, could it be that your component legs are coated with a leadfree finish? This can have an inpact on soldering when your temp.peak in only 220�C and the melting point of pure Tin is 237�C. Best regards, Daniel

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