Electronics Forum: 2221 (Page 1 of 7)

Thermal Relief

Electronics Forum | Wed Mar 03 09:05:28 EST 2004 | davef

Look to IPC-2221, 9.1.3 Thermal Relief In Conductor Planes


Electronics Forum | Wed Feb 22 20:33:25 EST 2006 | davef

Here's your design rules: * IPC-2221 * IPC-2222 Bonus is that they include the works, not just break-away tabs

Re: silver finishes on pcbs

Electronics Forum | Wed Dec 13 20:30:59 EST 2000 | Dave F

Immersion Silver PCB Surface Plating - Dennis VanBuren 14:21:24 02/01/2000 [Wudja mean "not much luck" searching the archives? What is this haggis???][Is that like saying "what is this chopped liver??"]

Gold coated spring contacts

Electronics Forum | Tue May 22 18:21:15 EDT 2001 | davef

Again not quite what your looking for, but close, consider IPC-2221, Generic Standard On Printed Board Design, Para. 4.4.4 for minimum requirements for edge board connectors, as a baseline.

Tape and Reel

Electronics Forum | Thu Oct 14 12:02:44 EDT 1999 | Larry Johnson

I was wanting to know if there was any type of formula that I could use to determine the correct packaging for a SMD For example, if I have the component measurements, can I find out what the correct width and pitch of the tape it comes in should be

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas

We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob

PCB copper to disipate heat

Electronics Forum | Thu May 09 17:19:28 EDT 2002 | davef

Can�t help you with the article that you read. Other places to start are: * 2221, 7.2 Heat Dissipation Considerations, 7.3 Heat Transfer Techniques, and 8.1.10 Heat Dissipation * 2222, 9.1.2 Thermal Relief In Conductor Planes

Through holes

Electronics Forum | Thu May 09 00:08:01 EDT 2002 | techment

Could someone provide help regarding IPC's recommendation on Plated Through hole's --- lead to hole ratio. I can't find it in IPC-2221 and IPC-SM-782. Thank you very much

PCBA Standards

Electronics Forum | Wed Jul 07 17:47:00 EDT 2004 | davef

For bare board design for test, try: * IPC-2221 - Generic Standard On Printed Board Design * Section standard for the board type [eg, IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards]

PBGA vias throwing solder balls

Electronics Forum | Wed Sep 15 22:43:24 EDT 2004 | davef

Just to help convince those on the fence that we don't know dip: 2221A, 4.5.1 tells you the vias have to be tented on both sides.

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