Electronics Forum | Wed Aug 24 08:03:17 EDT 2005 | james
I need some help here. I just to see what suggestions anyone else has. Our Man. Eng. has 3 profiles on our 9 zone Heller Reflow oven. These are the profiles: 1. 120 140 150 150 180 200 215 250 220 29in per minute 2. 120 130 145 150 150 185 20
Electronics Forum | Wed Mar 29 13:28:45 EST 2006 | jsloot
We have been experiencing a reflow issue with a SMT diode 4007. This is a SMA or DO 214-A package. It is a lead free part used with 63/37 paste no clean flux. The problem is it is not consistant. 100 diodes can be reflowed rock solid on the board and
Electronics Forum | Fri Aug 25 09:12:07 EDT 2006 | russ
When not practical to drill hole into pcb to profile here is what I do and seems to be just fine. place thermo into area underneath BGA and let her rip, you will not be in the ball/solder joint, but the temp difference as long as you are in the arra
Electronics Forum | Wed Sep 20 15:25:15 EDT 2006 | lheiss
Hey All, Thanks for all of your help to date. While running the nozzle height test I noticed that the Z-rod is bent. Probably happened after setting the "X closed loop soft home" back to 50 from 384 which was probably why the nozzle slammed into t
Electronics Forum | Fri Oct 06 09:38:11 EDT 2006 | C.K. the Flip
Here's the BGA voids-reduction profile that I used: http://img323.imageshack.us/my.php?image=profileka0.jpg Keep in mind, this was for Sn/Pb BGA with Sn/Pb solder paste. For your situation, you might want to raise the peak temperatures to at least
Electronics Forum | Wed Nov 29 10:10:50 EST 2006 | M. Sanders
I'm sorry, Dave - I didn't make myself very clear. Yes, this space (not really a "gap") is filled with solid solder. For instance, if you place a gull-wing component in solder paste, after reflow, there will probably be a thin film of solidied solder
Electronics Forum | Mon Aug 06 14:05:02 EDT 2007 | slthomas
BEC hardware would be on the machine as a sensor underneath the placement table, to the left of the C&C, and an emitter attached to a bracket to the left of the insert head. The two line up with each other and the sensor uses a quadrant layout to det
Electronics Forum | Fri May 02 16:20:35 EDT 2008 | rwyman
We've never, to my knowledge, sent out Pb-free BGAs to be reballed for use on an SnPb assembly. In fact, we developed an in-house reballing process and we haven't felt the need to do that either (for salvaging an occasional reworked part, maybe).
Electronics Forum | Thu Aug 20 18:11:53 EDT 2009 | smt_guy
Hi davef, thanks again for that enlightenment. I'm just curious about what's happening with the solder joint of the said process. Again to add to my unending queries for now: So on top of that copper is a thin layer of lead-free solder composition
Electronics Forum | Tue Dec 15 12:23:47 EST 2009 | swag
I have moved golden boards from chains to mesh as I got tired of fishing t-couples under the chain rail. I saw a 3-5 deg. decrease on top-side parts peak temp. (all t-couples were on top side). I had to bump zones 6 and 7 a few degrees to make up f
