Electronics Forum | Wed May 24 13:10:28 EDT 2006 | Chunks
VIP 98, I believe that's a 7 zone if I can remember 6 years ago. Try 150, 165, 200, 235, 235 and 235 (top and bottom temps) with a belt speed of 35 inches per minute. This should get you in the ball park depending on the size of your board.
Electronics Forum | Sun May 24 21:12:59 EDT 2009 | keith78
I have a problem recently to qualify QFN package on solder joint reliability. The pcb thickness stated in IPC-9701 is 2.35mm but from the in-house test, QFN surface mount on 2.35mm thickness PCB board have a short cycle to failure due to higher CTE m
Electronics Forum | Fri Dec 22 20:09:31 EST 2000 | SANTANA, ABELARDO RDZ.
looking for anybody that has constant problems with their equipment. I need advice on whether it is a known problem or if it simply human error. I have 2 gsm's line's need to get production way up, and have repeatability on a constant basis.
Electronics Forum | Tue Jan 23 13:16:09 EST 2001 | CAL
Hoover-Davis makes excellent feeders. You may want to also try http://www.delawaretechnologies.com/prd_smtf.htm The person to speak with is Don Dawson 609-235-8454. Deleware Technologies makes feeders for most placement machines. Cal
Electronics Forum | Wed Jul 06 18:11:37 EDT 2005 | russ
Please search the archives as this has been discussed on many occasions. Everything should be fine except for BGAs which will require a higher temp of 235C at the peak in reflow.
Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef
Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.