Electronics Forum | Wed Dec 13 06:08:48 EST 2000 | jackofalltrades
We have seen this type of problem. After eliminating possibility after possibility we corrected the problem by throwing out the glue and starting fresh. It was not expired, just bad for whatever reason, we could not asertain what went wrong with it.
Electronics Forum | Thu Aug 16 19:54:12 EDT 2001 | davef
Understanding Temperature Coefficient of Resistance * http://www.riedon.com/temp_coeff_nt.htm * http://hyperphysics.phy-astr.gsu.edu/hbase/electric/restmp.html * http://www.rit.edu/~674www/programs/phys273/temp_coeff.html
Electronics Forum | Mon Dec 11 20:56:29 EST 2000 | Dave F
I'm with ya John. I'm afraid I'm in brain lock on picturing the situation, mostly because of my bias against waving second side MELF. I know people do it, but we've never had good luck. It would be good if we could have a clear process flow to hel
Electronics Forum | Tue Dec 12 08:44:27 EST 2000 | Wolfgang Busko
Another theory just developed in this very moment is that the glue did for what reason ever become "liquid" to a certain degree allowing gravity to do what gravity normally does but only to a certain point where this bubble-gum-like state stopped ( w
Electronics Forum | Mon May 08 20:45:09 EDT 2000 | Dave F
Peter: How about a SMT test point? E-Mark (0603 0805) 273 Canal St Suite 414 shelton CT 06484 800.831.5383 www.e-markinc.com OXLEY (round test point gold color but difficult to pickup) Component Corp (loop ~ size of 1206 silver color works fine)
Electronics Forum | Thu Jul 18 11:59:47 EDT 2013 | justinlevine24
Hi Eric, What ESS test equipment are you looking into specifically? This will allow us to help answer your questions better. Best Regards, Justin Levine OEM Company | Global Sales Division [Office] 408-675-5613 | [Cell] 480-273-6068 email: Ju
Electronics Forum | Thu Jul 18 17:51:13 EDT 2013 | justinlevine24
Yes, I have a few in our system. Send me a message with your needed specs and I can match it up for you. Justin Levine OEM Company [Cell] 480-273-6068 email: Justin.l@oemcompany.com www.oemcompany.com
Electronics Forum | Fri Dec 08 18:37:01 EST 2000 | Dave F
Asymetry in heating or mechanical forces are the primary reasons for tombstoning regardless of the reflow method. [There's beaucoup of background in the fine SMTnet Archive on reflow tomstoning.] Your situation is curious, but at least you know why
Electronics Forum | Sat Nov 05 01:22:23 EST 2005 | koeka
All, We are having insufficient hole fill only at DIMM connector area(120 pin/row total two or 4 rows at that area) when we switch to lead free (SAC and Sn/Cu). The finish we using is immersion silver. Preheat on top side ~98-118oC. Rosin flux type.
Electronics Forum | Fri Dec 08 11:08:03 EST 2000 | Antonio
Ok fellas, tell me how you'd fix this! I'm having melf connectors that are tombstoning in the wave, NOT the reflow, the wave. I've never seen this before. All other parameters are the same...solder, preheats, placements, the board, building humidi
