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av rio san no 145 Park industri del rio Greater

http://www.hellerindustries.com/search.php?zoom_query=av+rio+san+no+145+Park+industri+del+rio+Greater&zoom_per_page=10&zoom_and=0&zoom_sort=2

/news.php?subaction=showfull&id=1351537002&archive=&start_from=&ucat=2& Heller 1808 Mark 3 Reflow Oven ... Concepts Unlimited buys 2nd oven at Apex 2015! 02 Mar 2015| Engineering Concepts Unlimited of Fisher, Indiana visited the Apex Show in San Diego and purchased their 2nd machine in 2 years from the show. Heller Industries , a 2014 Service Excellence Award Winner for Soldering ... facility. Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High av rio san no 145 Park industri del rio Greater Reflow Soldering Dual Lane / Dual Temperature Curing & Back-end Semiconductor Voidless / Vacuum Fluxless / Formic Acid Soldering Pressure Curing Ovens (PCO {Corporate Sales Headquarters, Service ... URL: http://www.hellerindustries.com/network-usa.php Frost & Sullivan Lauds Heller Industries' Exceptional Growth Borne of its Advanced SMT Reflow Soldering Equipment for Industry 4.0 ... noted Apoorva ... innovations in the reflow and curing processes. www.hellerindustries.com. For additional information: contact Heller Industries , Inc. 4 Vreeland Road, Florham Park , NJ 07932, USA See the original article on the Frost& Sullivan website

av rio san no 145 Park industri del rio Greater

http://www.hellerindustries.com/search.php?zoom_query=av+rio+san+no+145+Park+industri+del+rio+Greater&zoom_page=1&zoom_per_page=10&zoom_and=0&zoom_sort=2

/news.php?subaction=showfull&id=1351537002&archive=&start_from=&ucat=2& Heller 1808 Mark 3 Reflow Oven ... Concepts Unlimited buys 2nd oven at Apex 2015! 02 Mar 2015| Engineering Concepts Unlimited of Fisher, Indiana visited the Apex Show in San Diego and purchased their 2nd machine in 2 years from the show. Heller Industries , a 2014 Service Excellence Award Winner for Soldering ... facility. Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High av rio san no 145 Park industri del rio Greater Reflow Soldering Dual Lane / Dual Temperature Curing & Back-end Semiconductor Voidless / Vacuum Fluxless / Formic Acid Soldering Pressure Curing Ovens (PCO {Corporate Sales Headquarters, Service ... URL: http://www.hellerindustries.com/network-usa.php Frost & Sullivan Lauds Heller Industries' Exceptional Growth Borne of its Advanced SMT Reflow Soldering Equipment for Industry 4.0 ... noted Apoorva ... innovations in the reflow and curing processes. www.hellerindustries.com. For additional information: contact Heller Industries , Inc. 4 Vreeland Road, Florham Park , NJ 07932, USA See the original article on the Frost& Sullivan website

Archives for February 27th, 2015 | Baja Bid LLC

http://bajabid.com/2015/02/27/

. The bidding period opens on March 2nd and closes on March 18th. The items being sold include Universal “Hitachi” Quadris SMT Pick & Place Machines & Feeders, Ekra E5 & X5 Screen Printers, Vitronics XPM2 Reflow Ovens, Mydata

Archives for February 27th, 2015 | Baja Bid LLC

https://bajabid.com/2015/02/27/

. The bidding period opens on March 2nd and closes on March 18th. The items being sold include Universal “Hitachi” Quadris SMT Pick & Place Machines & Feeders, Ekra E5 & X5 Screen Printers, Vitronics XPM2 Reflow Ovens, Mydata

Essemtec Fox2 an der «World of Technology & Science» Messe - Utrecht Ι Essemtec

https://essemtec.com/en/news/news-detail-en/-/-/essemtec-fox2-at-world-of-technology-science-exhibition-utrecht/

Essemtec Fox2 an der «World of Technology & Science» Messe - Utrecht Ι Essemtec Home Products pick-and-place Puma Fox dispensing Tarantula Spider Dispensing Valves component storage Cubus Cubus Large production software reflow ovens applications News company why essemtec Service The «World of Technology & Science» fair takes place in Utrecht (Netherlands) between 2nd and 5th October 2018... The «World of Technology & Science » fair takes place in Utrecht (Netherlands) between 2nd and 5th October 2018, where we will present our Fox2 Pick and Place Solution

ICT System Engineer Ι Essemtec AG

https://essemtec.com/firma/jobs/ict-system-engineer/

ICT System Engineer Ι Essemtec AG Home Produkte SMT Bestückung Puma Fox Optional Equipment SMT Dosieren Tarantula Spider Dosierventile Optional Equipment Bauteillagerung Cubus Cubus Large Produktions Software Produktions Software Software Upgrades Reflow zählt rund 80 Mitarbeitende. Zur Verstärkung unseres Teams suchen wir Sie als ICT System Engineer (w/m) Ihre Aufgaben: • 1st- und 2nd-Level und 3rd-Level Support

Seika Machinery Presented 2014 Sales Awards during IPC APEX EXPO | Seika Machinery, Inc

http://seikausa.com/news/seika-machinery-presented-2014-sales-awards-during-ipc-apex-expo

.’s Senior Sales Manager and Sales/Marketing Manager.  The 1st place McDry 2014 Sales Award was presented to Assembly Tech.  The 2nd place McDry 2014 Sales Award was presented to WittoSales Unitech PCB Cleaners Malcom SMT & Solder Process Control SMT Products Sayaka PCB Router Nihon Superior Solder AI-TEC PCB Conformal Coating and Curing System Seitec Selective Solder Andes Eightech Reflow Ovens Tamura iLead-Free Reflow

Seika Machinery Presents 2015 Sales Awards during APEX | Seika Machinery, Inc

http://seikausa.com/news/seika-machinery-presents-2015-sales-awards-during-apex

: Hisco Atlanta 2nd place: Ceiba Technologies 3rd place: WittcoSales   The 1st place SAYAKA 2015 Sales Award was presented to Horizon Sales Unitech PCB Cleaners Malcom SMT & Solder Process Control SMT Products Sayaka PCB Router Nihon Superior Solder AI-TEC PCB Conformal Coating and Curing System Seitec Selective Solder Andes Eightech Reflow Ovens Tamura iLead-Free Reflow

Wire tacking labels for PCB rework and assembly able to sithstand reflow temperatures 10mm round in

http://www.soldertools.net/hotdot-tm-s-10mm-round/

. James K 2nd Oct 2013 Neat way to hold down wires during reflow This is nice way to hold down wires during reflow. Write a Review Name Wire tacking labels for PCB rework and assembly able to sithstand reflow temperatures 10mm round in shape | Soldertools.net arrow-right arrow-left chevron-down close basket account search wishlist star spinner check-mark grid list lock plus BEST soldering geeks enable electronics companies to be more effective through . This material combination has already been proven to stay in place during wave and reflow soldering processes and bake-out cycles as tens of thousands of rework stencils have been placed on boards using this material ™ , Butterfly, Width 10mm Qty –272count     Other features:        - 2-4 minute service temperature range at reflow temperatures        - Great dimensional stability-even during reflow cycles

Detail

https://www.zestron.com/us/news/press-releases-zestron-americas/detail/zestron-will-be-exhibiting-at-imaps-2019.html

. The exhibits will be open on October 1st and 2nd, and ZESTRON will be exhibiting at booth #211. For more information or to register, please visit www.imaps.org/imaps2019 Reflow Ovens Wave Solder Ovens Dispensing Needles PCBA Cleaning Power Electronics and Packages Power Modules Leadframes Power LEDs Flip Chip Packages CMOS BGAs MRO MRO Cleaning Precision Parts Cleaning

ZESTRON Technical Workshop - ZESTRON

http://www.zestron.com/sa/news/news-details/zestron-technical-workshop.html

.   “This will be our 2nd year of hosting this technical workshop in the Philippines, being well received by customers. It serves as an avenue for customers to learn about the latest cleaning technologies, as well as network amongst industry experts / Condensation Traps Reflow Oven Cleaning - SMT Solder Oven Cleaner Wave Solder Ovens Dispensing Needles Power Electronics Cleaning Power Module Cleaning Leadframes

Best Papers - Award Winners | SMTA International

https://www.smta.org/smtai/best_papers.cfm

. Klein Wassink, Philips CFT, Holland "The Use of Nitrogen in Reflow Soldering" 1992: John Maxwell, JMA, Colorado "PC Board Design Techniques for Subminiature Chips" 1991: Dr ., Nokia Bell Labs and a team of co-authors from the iNEMI/HDPUG 3rd Generation Pb-Free Alloys Project " Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys " 2018 2nd Place Packages " View past award winners 2017 1st Place: Andre Delhaise, Celestica " Effect of Thermal Treatment on the Microstructure, Properties, and Reliability of Lead-Free Bismuth Containing Solder Alloys " 2017 2nd Place . Benlih Huang and Dr. Ning-Cheng Lee, Indium Corporation of America "Low Cost Solder Bumping Via Paste Reflow" 2000: N.P. Kim, M.J. Holland, C.-P. Chien, and M.H. Tanielian, Boeing Corporation . Colin Lea, National Physics Laboratories "Inert IR/Reflow: The Significance of the Oxygen Concentration in Nitrogen and Nitrogen-Hydrogen Atmospheres" ^ Hide

Intermountain (ID, UT) Chapter

https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=38

:00am Oven Reflow and X-Ray Best Practices, for Preprogrammed Flash Memories Speaker: Dave Rohona, Data I/O Corporation 12:00pm COMPLIMENTARY LUNCH FOR ALL REGISTERED ATTENDEES   1:00pm 1 :00PM Oven Reflow and X-Ray Best Practices, for Preprogrammed Flash Memories   Speaker: Dave Rohona, Data I/O Corporation Today’s modern luxury cars are governed by around one hundred million lines of code .  Preprogramming is the preferred method used in automotive today, delivering the lowest total cost of programming. Preprogrammed flash memories processed through oven reflow and X-ray inspection require production line managers follow recommended best practices .  This presentation will discuss the impact of thermal heat and dose radiation on preprogrammed Flash Memories along with Data I/O’s recommended best practices to ensure data retention post oven reflow and X-ray. 2 *  Data IO X-ray Reflow SMTA Weber State  (Click Link to presentation)      -  Data IO White paper on the X-ray issue:  (Click Link to presentation

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

http://www.hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

Reflow, Section 6.1, Voiding,” Butterworth-Heinemann, Reed Elsevier Group, 2002. [2] R. J. Klein Wassink, Soldering in Electronics, A Comprehensive Treatise on Soldering Technology for Surface Mounting and Through-Hole Techniques, 2nd Edition The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL . THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY Richard Coyle1, Dave Hillman2, Michael Barnes3, David Heller3, Charmaine Johnson1, Richard Popowich1 ., Osaka, Japan 6Heraeus, Frankfurt, Germany 7Indium Corp., Clinton, NY, USA richard.coyle@nokia-bell-labs.com david.hillman@rockwellcollins.com ABSTRACT A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance . Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints

Yamaha YGD Machine 100W AC Motor KGM-000 Second Hand Q2AA04010DXS2C

http://www.smtspare-parts.com/sale-8509009-yamaha-ygd-machine-100w-ac-motor-kgm-000-second-hand-q2aa04010dxs2c.html

; 2nd, we will test the quality of the goods before shipment ; 3rd, we will be responsilbe when the parts get in any problems .     Hope you enjoy the shopping ! Tag 750W Heller Reflow Oven Motor 90W Conveyor Motor 90W 3 Months Warranty SF-JR 1/2 HP 4P Vacuum Pump Motor For CM602 Surface Mount Machine P50B02002DXS35 Samsung 20W Servo Motor Driver CP63 SM310 Z-AXIS

Custom Rework | Process Troubleshooting, Fine Wire Cutting - BEST Inc

https://www.solder.net/other-services/

Removal Site Preparation Component Placement Component Reflow Inspection Reballing StencilQuick™ Method EZReball™ Method High Volume Method Ceramic Reballing Method Reballing Process BGA Handling DRY Packaging Challenges Optional Reballing Services Underfill rework Lead free rework INSPECTION OF ELECTRONICS HOW . We can either document a process given a problem or we can .come on site to be a “2nd set of eyes” to review the process. LEAD TINNING BEST offers hot solder dip services

How to make a good PCB solder ball

https://www.ourpcb.com/solder-ball.html

. Solder balls are created through sequential flow/quench or reflow processes. After passing through these processes, they’re then degreased and classified that are <=0.13mm in diameter can cause defects. Such defects occur when five solder balls with the stipulated diameter are placed with 100mm^2. You can inadvertently create detrimental solder balls during automated reflow, as well as during hand soldering . The defective solder ball can occur either during the printing process, the pick-and-place process, or reflow process. Solder balls are integral parts of most consumer electronics ? Here are some of the cause of solder balls. Moisture The presence of moisture in your solder paste can cause solder balls to explode during reflow . Moreover, when the board undergoes heating in reflow, these contaminants are forced out. Their abrupt escape shoots gases in all directions and consequentially blows liquid solder across the board

Tenting Via - The Ultimate Guide To The Importance of PCBs

https://www.ourpcb.com/tenting-via.html

. Tenting is also ideal for vias located close to SMT pads, where it reduces chances of short that occur during reflow. Sometimes, the tented via is again given a coat of solder mask . If you are not able to control the rise, then the solder mask can smear on the surface while the assembly reflow is carried out. Vias can be plugged with conductive and non-conductive fill :43:05+08:00 January 2nd, 2019 | Blog | Comments Off on Tenting Via – The Ultimate Guide To The Importance of PCBs Hey, I am John, General manager of OurPCB. I am a responsible, intelligent and experienced business professional with an extensive

Journal of SMT Articles

http://smta.org/knowledge/journal.cfm

: Thermal Cycling Testing Dr. Stephan J. Meschter, Polina Snugovsky, Jeffery Kennedy, Zohreh Bagheri, and Eva Kosiba Purchase  28-2 Effect of Reflow Time on Wetting Behaviour, Interfacial Reaction and Shear Strength of Sn–0.3Ag   2014 27-4 The Effects of Reflow Profile Parameters on Sn-Ag-Cu Solder Bumps and Cu Substrate Using Full Factorial Design Gabriel Takyi, Ph.D. and Peter K. Bernasko, Ph.D. Purchase ACHIEVING HIGH RELIABILITY LOW COST LEAD-FREE SAC SOLDER JOINTS VIA MN OR CE DOPING Dr. Weiping Liu, et al. Purchase  22-3 REFLOW PROFILE EVALUATION FOR LEAD-FREE STACKED CSP COMPONENTS SUBJECTED TO MULTIPLE REFLOW CYCLES Satyanarayan Iyer and Krishnaswami Heather McCormick, Polina Snugovsky, Zohreh Bagher Purchase  20-2 65nm FCBGA RELIABILITY FOR NEXT GENERATION GAMING DEVICE1* PHASE I-A METHODOLOGY FOR STREAMLINE PRODUCT DESIGN CYCLE AND 2ND SYSTEM LEVEL QUALIFICATION Paul P.E. Wang, Ph.D.1, DongJi Xie . Purchase  18-4 EFFECT OF DEVIATING FROM THE REFLOW PROCESS WINDOW FOR LEAD-FREE ASSEMBLY Manivannan Sampathkumar et al. Purchase  18-4 GENERAL APPROACH IN REDUCING EMI FOR 3D MICROELECTRONICS SENSORS Alessandro Gandelli et al. Purchase  18-3 SMT GOES FROM

Space Coast (Melbourne FL) Chapter

http://smta.org/chapters/chapters_detail.cfm?chapter_id=114

. This method also has the added benefit of being fully compatible with current manufacturing processes, adding only extra placement steps without the need to change reflow profile, equipment, etc :00PM Optimization of the Reflow Profile to minimize Voiding MB Allen, KIC  Void reduction is a significant concern and controversial topic in electronic assembly . Voiding impacts electrical, thermal, and mechanical performance. There are many variables such as substrates, components, solder paste, acceptable void levels and of course the reflow profile . This discussion will focus on the optimization of the reflow profile as one of the solutions for the reduction of voiding.     11:30AM-1:00PM COMPLIMENTARY LUNCH 1 :00 PM Soldering Challenge Begins Special Thanks to Our Soldering Challenge Sponsors:   To Our Valued Suppliers The Space Coast Chapter SMTA will be holding our 2nd Annual ‘Soldering Challenge

Lead free wave solder

http://ce-exchange.com/detail/sunandmountain-da-450lfc-wave-solder-5737.cfm

and Place Screen Printer Fluid Dispenser Reflow Oven Wave Soldering PCB Wash & Stencil Cleaner AOI - SMT Inspection ICT Test & SMT Rework Thru-Hole : 4KW/zone Solder Pot Material: 100% titanium Solder Pot Heater: Cast iron Heater Power: 1.2KW*10pcs Number of Wave: Dual wave Wave Types: Turbulence (1st) and Lambda (2nd) Melting time

Soltec Delta wave solder with Select X debridging system

http://ce-exchange.com/detail/soltec-delta-6622cc-wave-solder-5719.cfm

and Place Screen Printer Fluid Dispenser Reflow Oven Wave Soldering PCB Wash & Stencil Cleaner AOI - SMT Inspection ICT Test & SMT Rework Thru-Hole   It has a removable 1.5 foot slide input for hand input of boards Single nozzle Spray Flux   1st section: Bottom side convection only 2nd Section

Document Revision Table | IPC

http://ipc.org/4.0_Knowledge/4.1_Standards/revstat1.htm

; Supersedes IPC-SF-818 05/95 SMC-WP-004 Design for Success    Orig. 4/97   SMEMA 4 Reflow Terms and Definitions        J-STD-005 Requirements for Soldering Pastes   J-STD-020 Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices  B-10a Rev E 12/14 Rev D Amend 1  3/08 Rev D  8/07 Rev C 7/04 Rev B 7/02 Rev A 4/99 Orig of Moisture/ Reflow Sensitive ICs   Superseded by J-STD-020 and J-STD-033 Rev A 1/95 Orig. 12/90   IPC-MC-790 Guidelines for Multichip Module Technology Utilization    Orig. 8/92   IPC-S-801   5-23a Superseded by IPC-804 and J-STD-003   IPC-S-803   5-23a for Mass Soldering (Wave and Reflow) Processes  5-22h Orig.  5/01   IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies 7-34 Rev B  11/07 Rev A  10/03 Orig.  4/98; Supersedes IPC-R-700C   IPC-7801 Reflow Oven Process Control Standard B-10a , Thermal Stress, Convection Reflow Assembly Simulation D-32 Orig. 12/10   IPC-9641 High Temperature Printed Board Flatness Guideline 6-11 Orig. 6/13   IPC-9691 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test

No Job Name

http://ipc.org/4.0_knowledge/4.1_Standards/free/J-STD-003C-Amendment-1.pdf

)* The loss or removal of a basis metal or coating during a sol- dering operation. 3.3.1 Pre-Conditioning Equipment Replace the 2nd paragraph as follows: When reflow simulation is required as a preconditioning requirement, process the test specimens per IPC-TM . 1.5 Test Method Classification Insert new first paragraph, 2nd sentence as follows: This standard describes test methods by which the surface conductors, attachment lands, and PTHs may be evaluated for solderability a. ‘‘Reflow Simulation 2X’’ means two excursions through the reflow oven using one of the profiles defined in IPC-TM- 650, 2.6.27. Insert new rows ‘‘Solder Float Test – ‘M’ coupon’’ and replace appropriate Table 1-1 sections and notes as follows : Test Method Surface Finish Pre-Conditioning Default Alternative Conditioning Applies to Surface Features Plated Through Holes Edge dip test Pb-Containing Steam exposurea Reflow Simulation2X (3.4.2 )b,c Yes NA All other 8 hours (3.4.2)b Reflow Simulation2X (3.4.2)b,c Yes NA Wave solder Pb-Containing Steam exposurea Reflow Simulation2X (3.4.2)b,c Yes

VT-RNSII

http://islandsmt.com/wp-content/uploads/2017/05/VT-RNS-2-Brochure.pdf

79.7 146 M Type L Type Dimensions For Even More Efficient SMT Production Introducing the 2nd Generation RNS Series L sizeM size P/Z/S 3-CCD camera Image signal input unit Main unit PCB fixing method . 40,000 lands/PCB max. 10,000 components/PCB max. Post-placement (before reflow) Post-reflow 50(W)×50(D) to 333(W)×255(D) mm 0.3 to 2.5 mm Above PCB: 20 mm (0.79 in) (standard), 40 mm (1.57 in) (optional) Below PCB: 40 mm (1.57 in) Above PCB: 20 mm (0.79 ) Post-placement (before reflow) Post-reflow 80(W)×50(D) to 510(W)×460(D) mm 80(W)×110(D) to 510(W)×460(D) mm (with PCB warpage correction unit) 0.3 ] Four advantages only Omron can provide Improved image processing for faster post-reflow inspections NEW Compared to the first generation VT-RNS 20% Faster EzTS ( Ez-image Teaching . Omron has reduced post-reflow inspection times by 20% by utilizing faster shutter speeds and improved image processing. So easy that anyone can set up inspection programs

GS329-2008-06-02.fm

http://islandsmt.com/wp-content/uploads/2017/05/MyReflow-Series-specification.pdf

) in a reflow process. PCB’s are transported by a conveyor system over the preheat, solder and cooling stations. The myReflow.com is designed to meet the European CE directives Advanced Cooling Optional Controlled cooling (only in combination with advanced cooling)➊ Setpoint 1st zone - 70-100°C Setpoint 2nd zone - 50-80 ³/h nitrogen consumption, <100 ppm in reflow DESCRIPTION DIMENSIONS STANDARD/OPTIONAL Flux management system, reduces maintenance intervals, incl . Exhaust stack filter Standard 2nd Generation Condense Filtration System, includes active residue separation unit Optional myReflow.com 1 9 SPECIFICATION GS329 1.8 REQUIREMENTS

http://www.nordson.com/en-us/divisions/asymtek/Documents/Articles/2008_12_Jetting%20PoP%20Underfill_AdvPkg_NordsonASYMTEK.pdf

. When dispensing underfill for PoP, larger fillets extending higher in the Z-di- rection occur because of the 2nd layer in- terconnect and the material contact angle . Placing the shield af- ter the underfill process poses fewer challenges accessing the component edge, however, an extra reflow pro- cess is needed for complete underfill. It is important that underfill materi- al not be fast flowing or have too low a viscosity. To successfully underfill the 2nd layer of the PoP, material must re- main in contact with the bottom side of the top package, or capillary action will no longer flow to that level. If the ma- terial is too low in viscosity there are issues created at the 2nd level because the underfill “slumps” out before the 2nd layer is underfilled. If the mate- rial flows to fast, the 1st level pulls a disproportionate amount of materi- al from the reservoir and robs mate- rial from the 2nd level, again dropping the height of the underfill reservoir resulting in an incomplete fill of the 2nd level. This is a consideration that does not exist in single-level CSP un

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