Electronics Forum: 3

Interpretation for IPC 600H for Clause 3.3.2 (Lifted Land - Cross Sectioned)

Electronics Forum | Mon Apr 28 02:22:52 EDT 2014 | jkhiew

We found repeated pad lifted after different SMT Reflow temperature (eg: 243 deg C and 233 deg C) at an isolated slot. The PCB Supplier had claimed that such condition is acceptable as per IPC 600H Clause 3.3.2 (Cross Sections) - eg: Acceptable - C

Upside down placement of a crystal oscillator is acceptable ?? As per IPC 8.3.2.9.2 clause its define Rectangular or Square En

Electronics Forum | Tue Jul 19 03:06:42 EDT 2016 | ishwarsingh1

Upside down placement of a crystal oscillator is acceptable or not ?? As per IPC 8.3.2.9.2 Rectangular or Square End Chip Components – 1, 3 or 5 Side Terminations.I am not sure whether is applicable for crystal oscillator or not . Your answer wo

Why 50 mils in 0805 package instead of 40 mils.

Electronics Forum | Fri Oct 03 09:00:18 EDT 2003 | davef

EIA standard packages have a variety of L/W proportions. EIA Dimension mm (LXW) Proportion (L/W) 0201 0.6X0.3 2 0202 0.5X0.5 1 0303 0.8X0.8 1 0402 1.0X0.5 2 0504 1.25X1.0 1.25 1.4X1.4 1 0603 1.6X0.8 2 0805 2.0X1.25 1.6 1111 2.8X2

Wireless USB Developer's Conference

Electronics Forum | Thu May 26 00:52:17 EDT 2005 | Adnahn

And once again the mighty Dave is right! Liverpool 3 - 2 on penalties

Mydata TP11

Electronics Forum | Fri Sep 30 12:10:28 EDT 2005 | vikkaraja

Firmware version is 2.3.2d.

Lead Free Usage

Electronics Forum | Mon Dec 11 08:55:21 EST 2006 | jdengler

See http://leadfree.ipc.org/RoHS_3-2-1.asp Jerry

GSM Discrete I/O Address List

Electronics Forum | Mon Jan 18 12:49:38 EST 2016 | ttheis

The machine is running UPS 3.2.2c on OS/2 2.1.

2 oz Copper thickness??

Electronics Forum | Tue Apr 23 15:35:45 EDT 2013 | dyoungquist

Check out IPC-A-600. Revision G (July 2004) section 3.2.3 (surface) and section 3.2.4 (internal) give min/max thicknesses for various weight copper. The min also changes depending on what class (1-3) standard you are working to.

SMT component handling

Electronics Forum | Fri May 11 07:37:22 EDT 2007 | davef

IPC-A-610D 3 Handling Electronic Assemblies 3-1 3.1 EOS/ESD Prevention 3-2 3.1.1 Electrical Overstress (EOS) 3-3 3.1.2 Electrostatic Discharge (ESD) 3-4 3.1.3 Warning Labels 3-5 3.1.4 Protective Materials 3-6 3.2 EOS/ESD Safe Workstation/EPA 3-7 3.3

Machine ICOM 5000

Electronics Forum | Wed Dec 05 20:58:21 EST 2012 | davef

Look here IPC-TM-650 2.3.25 [http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/2-3_2-3-25-1.pdf ]

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