3,5

"3,5" search results in the Electronics Forums



305 results found for "3,5" in the Electronics Forums

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j-std-033 3.3.5.1 HIC Placement

Jan 21, 2020 | 3.3.5.1 HIC Placement states "The HIC may be placed anywhere in the MBB, but should not be placed un

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Aug 30, 2018 | I don't know your board, but for this specific part: 10mil round aperture on a 3.5mil stencil wit

Conformal Coating Coupons

May 8, 2017 | For anyone looking this up in the future, I ended up settling on part number "A-2-3.5", an aluminum,

Halogen-free Solder Reflow Quality Issues

Nov 3, 2015 | how long are your squeegees for 3 - 5Kg pressure?

moisture sensitive components/packaging

Sep 23, 2015 | "...air evacuation is not required (Figure 3-5). Light air evacuation may be used to reduce the pack

Yamaha YM84 S2

Aug 17, 2014 | Chapter 6 section 3-5 of the manual. If you don't have the manual send me your email and I'll send

Quad 4C vision alignment

Jul 22, 2013 |

Modify radial machine pitch from 2.5 to 3.5 pitch

Jun 16, 2013 | Does anyone have suggestion how to modify radial insertion machine to 3.5mm pitch? I have to insert

Topaz X Head Optimization

Feb 28, 2012 |

Attrition... how to measure it?

Jan 20, 2012 | If 3-5% of the attempted parts placed are dropped, you have a serious problem...that's 1 part droppe

Attrition... how to measure it?

Jan 20, 2012 | 3-5% is extremely high. Think of that in terms of DPMO. 5% fallout would be a 50000 DPMO. That's

Screen Printer

Aug 3, 2011 |

FUJI MCS Floppy Drive

Jan 21, 2011 | Hello, We have an MCS-30 with a 3.5 floppy drive. But we cannot copy programs to it if the program n

IPC J STD 004B Reliability tests

Dec 20, 2010 | Test Resistance to ECM shall be 65C +- 2C @ 88.5% +- 3.5% All SIR Measurements shall not exceed 100

Bullet Proof Barcode Scanner

May 13, 2010 | We use Honeywell 3800GHD24E linear scanners for barcodes down to 3.5 mils with no problems (priced u

Lead Free finish

Oct 28, 2008 |

Solder paste Density

Aug 13, 2008 | 8.4 * SAC305 => 7.36 * Sn-3.5Ag => 7.5 * '....in' [96.2Sn-2.5Ag-0.8Cu-0.5Sb] => 7.39 * Sn-4Ag-

BGA process

Jul 17, 2008 |

SMT component handling

May 11, 2007 |

LGA36 6.5 x 3.5 mm

Apr 21, 2007 |

BGA REWORK- IR OR HOT AIR CONVECTION ? IS THE BEST

Apr 21, 2007 | 150 grams)on a very thik board (> 3,5 mm)( we did it by DRS-24). On top to this, in case of need

LGA36 6.5 x 3.5 mm

Apr 15, 2007 |

LGA36 6.5 x 3.5 mm

Apr 12, 2007 |

LGA36 6.5 x 3.5 mm

Apr 6, 2007 |

LGA36 6.5 x 3.5 mm

Apr 6, 2007 |

LGA36 6.5 x 3.5 mm

Apr 6, 2007 |

LGA36 6.5 x 3.5 mm

Apr 6, 2007 |

LGA36 6.5 x 3.5 mm

Apr 5, 2007 |

LGA36 6.5 x 3.5 mm

Apr 1, 2007 |

LGA36 6.5 x 3.5 mm

Mar 31, 2007 |

LGA Processing

Mar 30, 2007 | Question: Does this formula apply even for the small LGA:s like LGA36 6.5 x 3.5 x 0.6 mm pad size 0.

LGA36 6.5 x 3.5 mm

Mar 30, 2007 |

LGA36 6.5 x 3.5 mm

Mar 25, 2007 |

LGA36 6.5 x 3.5 mm

Mar 24, 2007 |

LGA36 6.5 x 3.5 mm

Mar 24, 2007 |

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dual pot selective soldering

FPC* - Fluid Pressure Control - Dispensing Pump