Electronics Forum: 3

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 15:58:46 EDT 1999 | Adam Pratt

Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 18:24:13 EDT 1999 | Christian N.

Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jul 01 13:57:57 EDT 1999 | Kris Wiederhold

Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin

Tilted/Slant SMT Component Specs?

Electronics Forum | Tue Mar 26 23:26:35 EST 2002 | ianchan

Hi Guys, (Note: We are not talking about bill-board RES/CAP, we are talking about Z-axis slant/tilted RES/CAP with respect to the PCB pad Z-axis plane). 1) We ref through the IPC-A-610C specification "bible", and can not find a "chapter/verse" tha

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.

Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va

3D Vision vs 2D vision

Electronics Forum | Thu Jul 12 17:43:50 EDT 2001 | Steve

In order to understand your printing process, you cannot rely soley on 2D inspection. By implementing 3D-true volumetric measurement, a more comprehensive approach to correcting the process variation can be established. True volumetric / 3D inspect

Re: Top Side BGA Reflowing @ Wave Solder

Electronics Forum | Mon Oct 11 08:34:52 EDT 1999 | C.K.

Thanks for the acvice, Dave and John. Like I stated above, I didn't feel comfortable with changing wave parameters since I knew that we'd be compromising our wave quality. I'll try the peelable mask thing, reprofile, and let you guys know what i fo

Re: Cracked Capacitors

Electronics Forum | Thu Jun 17 06:04:48 EDT 1999 | Ron G. Belliard, EET

RE: Cracked Capacitors: I have worked for 3 1/2 yrs with SMTA and have found a similar problem with capacitors. Throughout my studies of the problem, I have discovered three contributing factors that caused this cracking either individually or in co

Re: Ceramic + Hi-temp solder

Electronics Forum | Wed Apr 21 20:50:26 EDT 1999 | Dave F

I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is abo

Discoloring of Soldermask and silkscreen

Electronics Forum | Mon Apr 12 19:28:26 EDT 1999 | Tom B

Netters, When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? 1. Kester 293 no clean 2. 2.1 C/s for 30s to 150 C 3. .5 - .7 C/s for 60s to 185 C 4. 1.5 C/s u


3,5 searches for Companies, Equipment, Machines, Suppliers & Information