Runma Robot Manufacturer takes a leading role in the research,development and production of automation robots like pick & place cartesian robot,full servo robot arm,linear robot,iml robot,1-, 2-, 3-, 5-axis robots,sprue picker.
TBX-9550 is a automatic high-precision coaxial-cable stripping equipment which is suited to strip flexible coaxial cable of 0.6- 3.5mm diameter,it can automatically complete multi-layer and multisegment wire cutting and stripping at one time.
Electronics Forum | Sun Jun 16 08:00:51 EDT 2013 | zaldytorres
Does anyone have suggestion how to modify radial insertion machine to 3.5mm pitch? I have to insert 3.5mm pitch Ecap but the industry standard radial machine could mount only 2.5 or 5 mm pitch. changing PCB or parts is not an option as it is not appr
Electronics Forum | Wed Feb 07 12:07:34 EST 2001 | stownsend
I know this subject has been beat to death, but I need a clarification. I keep getting mixed messages about how much gold is required on a PCB for a reliable solder joint. Some people are saying 3 - 5 microns, some are saying 3 - 5 micro inches. Do a
2010 Panasonic Panasert RL-131 Radial Lead Inserter NM-EJR1A 0.17 sec/component Resistor, Electrolytic - Ceramic capacitor, LED, Transistor, Filter, Resistor network APPLICABLE COMPONENTS 40 Component Inputs 200-400v,3phase, 50/60
WANTED BUYER, RENTER for 2010 Panasonic Panasert RL-131 Radial Lead Inserter NM-EJR1A 0.17 sec/component Resistor, Electrolytic - Ceramic capacitor, LED, Transistor, Filter, Resistor network APPLICABLE COMPONENTS 40 Component Inputs 200-400v,3p
Industry News | 2012-09-26 14:20:09.0
ZESTRON will feature HYDRON® WS 325 as well as the company's complete line of process solutions at the Austin (CTEA) Expo & Tech Forum.
Industry News | 2012-09-26 16:02:04.0
ZESTRON, will feature HYDRON® WS 325 as well as the company’s complete line of process solutions at the Austin (CTEA) Expo & Tech Forum in Austin, TX,
Technical Library | 2009-09-18 14:42:37.0
In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in available information. Such information is crucial for potential and existing users to fully address the cleanliness levels under their respective components. With the emergence of lead-free soldering and even smaller components, new challenges have arisen including cleaning in gaps of less than 1-mil.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Facilities: 220VAC, 1phase, 50/60Hz, 10Amp / Air: 0.4 - 0.5 Mpa Dimms: 40 X 51 X 57 in. @ 1654 lbs Product Terms: This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functi
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Thu Aug 31 00:00:00 EDT 2017 - Thu Aug 31 00:00:00 EDT 2017 | Shenzhen, China
NEPCON and Smart Factory 1.0—The Future of Electronics Manufacturing
Career Center | Calamba City, Laguna Philippines | Engineering
Electronic Manufacturing Services (EMS) – SMT-EOL Process Engineer (August 2005 – Present) • Responsible for feasibility study for existing product and new product and conceptualize product assembly or process flow taking into consideration the manu
Armverlängerung 30 cm CH0251 Verbindungsschlauch 2,5 m x ø 63 mm mit Klemmen CH0252 Verbindungsschlauch 3,5 m x ø 63 mm mit Klemmen CH0253 Verbindungsschlauch 7,5 m x ø
. Specifications Delivery Specifications and (*) General Properties Characteristics Unit Target value Test method Appearance pale yellowish fine grain QM-AA-634 Acid value [mg KOH/g] 5 - 15 ISO 2114 Volatility [%] max. 2,0 QM-AA-341 Content of Ca [%] 3,5 - 4,8 DGF-M-IV 4 *Particle size < 2000 µm [%] min. 99 ISO 4610