Electronics Forum: 3.0 (Page 1 of 10)

AMS 3.0 Build 30068

Electronics Forum | Tue Nov 11 14:33:12 EST 2014 | rangarajd

Hello, I'm currently using the AMS 3.0 Build 30068 software to program my assembleon MG1R and Topaz XII's. The software is currently running on XP and would like to upgrade the OS to win 7 or 8. Is anyone successfully running a newer version of AMS

AMS 3.0 Build 30068

Electronics Forum | Tue Nov 18 15:37:58 EST 2014 | proy

You might want to also post on Yahoo Assembleon Group Search AssembleonSMT on yahoo groups and maybe generate some activity on this subject. PR

Assembleon AMS 3.0 software

Electronics Forum | Tue Oct 19 18:02:57 EDT 2021 | steveoky

Does anyone have a copy of this software? Or by chance know how I can get a copy of the online command set? We need to load programs to a Topax x via rs232 or ethernet. Thank you

Assembleon AMS 3.0 software

Electronics Forum | Tue Oct 19 19:29:03 EDT 2021 | compit

What is this software? Do you have a LAN card inserted into the machine? I thought about adding a LAN card and LANTASTIC software (old, under DOS) but maybe you have a better idea?

Assembleon AMS3.0

Electronics Forum | Wed Aug 06 17:45:54 EDT 2014 | rangarajd

Hello: Does any one have a soft copy of AMS 3.0 manual?

Selective Soldering

Electronics Forum | Tue Sep 19 15:11:16 EDT 2006 | d0min0

Hi there, we use inertec els 3.0 and 4.0 machines regards

Leaching

Electronics Forum | Mon Apr 28 16:36:11 EDT 2003 | razor

Component: Termination (barrier) NI, 120/3.0 um Solder Plate (outer) 90% Sn, 10% Pb, 120/3.0 um Solder: Multicore CR39, 95.5%Sn/3.8%Ag/.7%Cu @ 6mil Flex PCB: Cu, Ni, Au .2m to .5m Thanks

should gold pads be pretinned, what issues are known are there?

Electronics Forum | Wed Sep 18 15:13:17 EDT 2002 | davef

Effects of Gold (Au) on Solder Properties Concentration Range in Weight Percentage w/o Au in Sn63/Pb37 Solder [A Sugarman/Loranger] * 2.0 - 3.0% Spreadability and fluidity of solder reduced (1) * 3.0% Highest acceptable concentration of Au in solder

Ag Saturation in SAC solder Paste

Electronics Forum | Thu Dec 16 16:28:51 EST 2004 | Indy

Hi, We are using Sn/3.0Ag/0.5Cu solder paste on Pd/Ag pad metallization in one of our application. Could someone provide me information on the following: 1. How bad is the Leaching of Ag in SAC alloy and how it can be mitigated. 2. During reflow so

Acceptance Criteria Ion Chromatography testing?

Electronics Forum | Thu May 31 21:45:48 EDT 2012 | davef

rsthompson ... if you're talking about bare boards IPC-5701, Users Guide for Cleanliness of Unpopulated PBC, Table 8 ||Bare board final surface finish Ions||Hot air solder level||OSP over copper||Gold over nickel Chloride||0.75 ug/cm^2||0.75 ug/cm^2

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