Electronics Forum | Tue Aug 30 12:49:59 EDT 2005 | Ted
Slaine, We use a Pd/Ag thickfilm paste. Because of the leaching we had to start using solder pastes that have silver in it. For RoHS, we are using a solder paste with an alloy of Sn95/Ag05. We also have to double print the thickfilm pastes. I h
Electronics Forum | Fri Feb 09 02:30:50 EST 2007 | Muhammad Haris
What are Resins, Solvents, Activators, and Thickening Agents in Solder Paste and what are their helpful and harmful effects? AND What are the purposes/properties and effects of Sn(Tin), Pb(Lead), Ag(Silver), Bi(Bismuth), In(Indium), Cu(Copper), Ni(
Electronics Forum | Wed Nov 07 21:36:17 EST 2012 | davef
Multiple process and rework thermal cycles are brutal on boards and components. Improving reliability of products through reducing thermal stress ends-up being a major driver to the interest in lower MP LF solders. Binary LF solders require the addit
Electronics Forum | Fri Nov 02 14:46:18 EDT 2012 | ericrr
So how does this (lead free paste Sn42/Bi58) solder compare with the Sn-Ag-Cu (Tin-Silver-Copper) combination which does not flow as well (in the oven), needs higher oven temperature, (that can be adjusted by reducing the oven chain speed) and cost m
Electronics Forum | Sat Nov 03 10:57:27 EDT 2012 | davef
EricR: Regarding "*** By the way, since we have used the Tin-Silver-Copper lead free solder there has been a strange liquid type chemical leek from the oven exhausted pipes." ... I don't know anything about your process, but the first thing I'd inve
Electronics Forum | Tue Oct 05 12:46:02 EDT 2021 | emeto
From what I understand SAC305 and SAC405 are considered low silver content and have the better overall mechanical qualities compared to more silver or no silver.
Electronics Forum | Wed Sep 29 19:47:44 EDT 2021 | emeto
"For the lead free soldering of electronic assemblies, the inclusion of silver in the alloy results in better wetting compared to non-silver containing alloys and also allows for a broader process window. Silver also improves joint reliab
Electronics Forum | Thu Sep 23 08:08:12 EDT 2021 | SN
Hi. Anyone in this forum experienced the lead-free solder paste SAC305 and SAC405? What are the differences to expect for solder paste with SAC305 and SAC405? What is the effect of silver (Ag) alloy in solder paste? It was really appreciated if could
Electronics Forum | Thu Sep 23 08:47:25 EDT 2021 | majdi4
1)Though in many cases the difference between SAC305 and SAC405 was small,and not always statistically significant, it was observed that SAC405 generally outperformed SAC305 joints. Under 0°C to 100°C thermal cycling,no statistically significant
Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef
First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu
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