Electronics Forum: 3053 (Page 1 of 1)

PSA vs HAA Throughput

Electronics Forum | Tue Sep 12 17:35:20 EDT 2000 | Gilbert Ramirez

Supplier currently using pressure sensitive cover tape. They tell me that getting a new system with heat sealed tape capabilities will cut their throughput in half. Could this be true?

Wire bonding ICs to flex foil

Electronics Forum | Fri Mar 05 04:39:38 EST 1999 | Pan Tian Shun

I need advise on how can bonding of ICs to flex foil be done. The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), and curre

Re: Wire bonding ICs to flex foil

Electronics Forum | Sat Mar 06 08:45:16 EST 1999 | Dave F

I need advise on how can bonding of ICs to flex foil be done. The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), a

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