Electronics Forum: 3059 (Page 1 of 1)

popcorning in wave soldering

Electronics Forum | Tue Sep 12 04:48:26 EDT 2000 | Daniel

Is there a risk of popcorning plastic components during wave soldering? (The PCB is first surface mounted, reflowed and washed. It is sometimes left in air environment for as long as 48 h before the throgh hole components are mounted and they are wa

Re: IPC 4101

Electronics Forum | Fri Mar 12 18:10:31 EST 1999 | Luis Alberto Garc�a G.

Please I want to know where I can get IPC standards. If you can help me please, send me a message by e-mail.

IPC 4101

Electronics Forum | Wed Mar 03 17:09:55 EST 1999 | Tom Reilly

We have recently had problems with bare boards coming in too thick. I would like to know how to properly specify the minimum and maximum thickness using the 13949F and IPC 4101 specs. (We currently use "MATERIAL: GFN 0620 C1/C1 A2A per MIL - P - 1394

Re: IPC 4101

Electronics Forum | Wed Mar 03 20:20:30 EST 1999 | Earl Moon

| We have recently had problems with bare boards coming in too thick. I would like to know how to properly specify the minimum and maximum thickness using the 13949F and IPC 4101 specs. (We currently use "MATERIAL: GFN 0620 C1/C1 A2A per MIL - P - 13

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