Electronics Forum | Fri Feb 16 08:28:50 EST 2007 | pavel_murtishev
Good afternoon, Typical plating thickness for immersion tin is 0.6-1.0um. I do not know what the maximal thickness is. But plating is self-limiting process and I believe maximal thickness should be about 2-3um. BR, Pavel
Electronics Forum | Wed Sep 03 07:43:13 EDT 2008 | davef
What do you mean by a "few micron thick"? IMC thickness pre-cycling (NEMI Lead-free) * Cu3Sn: 3um [118 uin] * Cu6Sn5: 1um [40 uin]
Electronics Forum | Mon Mar 15 01:38:46 EDT 2021 | researchmfg
Thanks for the answer. Did you really find the dust block the nozzle and sensor? By the way, If SMT environment need to control the dust then what size of dust need to be controlled? 0.3um, 0.5um or 10um?
Electronics Forum | Tue Jun 04 17:10:13 EDT 2002 | davef
First, �flash gold� is very loose language. It means different things to different people. �Flash� gold is a thin coat of immersion gold. Imm gold self-limits at ~0.3um[12uin]. And fabs put-down �flash� prior to electroplating thicker gold for wi
Electronics Forum | Tue Aug 21 05:05:52 EDT 2007 | vangogh
Hi All, I would like to get some inputs regarding this.... I have bare PCB which were stored with kapton tape attached on the Au plated pads. These were stored for close to a year. Upon removal of kapton tape, we noticed discolorations on the edges o
Electronics Forum | Tue May 26 07:42:54 EDT 1998 | Chris Sargent
Regardless of what various inspection standards state, has anyone got any information on how the strength of a soldered joint changes with the amount of solder in contact with the legs. ie if there is 0.152um depth of contact how does the joint stre
Electronics Forum | Tue Aug 17 11:31:39 EDT 2004 | Cal
Hello All- I need to replace my Foam flux aerator in my wave soldering machine and need a source. The "Stone" Size is 38x25mm @ 3um. If any one has a source thanks in advance. OBTW- this wave not a "Name Brand" machine (i.e. Eltrovert). Cal
Electronics Forum | Thu Oct 21 13:08:38 EDT 2021 | ademrah
Hi, It depends on smallest pitch size of your components. For the 0.3 um, 0.5 um, etc. sizes could be mentioned on Clean Room. For example; for ISO-7 standart (Class 10,000) higher than 5um is not acceptable, however 1mm can acceptable to describ
Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef
You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol