Electronics Forum: 4

Press-Fit Workmanship standard

Electronics Forum | Wed May 16 14:09:22 EDT 2001 | davef

First thing I'd use is IPC-A-610C, �4.8.2 Connector Pins - Press-Fit Pins. Does it work in your case?

Could use some help

Electronics Forum | Mon May 21 10:06:54 EDT 2007 | patrickbruneel

Dave, Thanks a lot; you truly are a living database. I will need new spectacles missed the eutectic alloy in table 4.8 of the Klein Wassink book.

nozzle level (low) out of tolerance (universal HSP)

Electronics Forum | Tue Aug 03 14:32:04 EDT 2010 | keiths487

random nozzle and head combo's all around the turret...head 1,4,8,11,13,14 and always nozzle 1 or 2

Marketing in Japan

Electronics Forum | Sun Apr 01 09:50:15 EDT 2001 | davef

I have no first hand knowledge, but the following may help: JAPAN MARKETING ASSOCIATION Head Office: 3 rd Floor, Wako Bldg., 4-8-5 Roppongi, Minato-ku, Tokyo 106, Japan Tel: +81-3-3403-5101 Fax: +81-3-3403-5106 http://www.jma-jp.org/JMAhome/Eng/Mai

SMD voids

Electronics Forum | Tue Jul 03 22:18:33 EDT 2001 | davef

Assuming that you are talking about voids in solder connections: * Consider voids on the surface of your solder connection a defect. * Consider voids that you can't see to be a process indicator. See A-610C, 12.4.8 for authoritative guidance.

Pull Test

Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef

A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen

PCB bake-out after cleaning

Electronics Forum | Wed Dec 17 10:25:47 EST 2003 | blnorman

I may have asked this question before but couldn't find anything when I ran a search. Question, after ultrasonically cleaning our boards we bake them out to drive off residual moisture. Current requirement is 24 hours @ 105�C. I seem to remember a

feeder pitch

Electronics Forum | Mon Feb 14 17:36:37 EST 2005 | griinder

WE ARE USING MIRAE MX240. ON THIS MACHINE, THE FEEDER ADVANCE AND THE FEEDER PITCH IS CONTROLLED BY THE MACHINE/SOFTWARE AS OPPOSED TO THE FEEDER ITSELF. OUR SELECTIONS FOR 24MM FDDERS ARE 4,8,12, 16, AND 24MM.I WAS WONDERING IF THE 20MM PITCH WAS UN

Selective Wave soldering machine

Electronics Forum | Mon Oct 12 16:01:42 EDT 2009 | dyoungquist

Check out RPS Automation. We have had good results with their selective solder machine that we purchased 1 year ago and they have wave nozzles as well in the 4-8 inch range. Changing from a selective solder nozzle to the wave nozzle takes only a fe

I need 15 - 25 microns (T5) Solder Paste

Electronics Forum | Wed Jan 05 17:56:30 EST 2011 | ppcbs

I am looking for a No-clean or water soluble solder paste, Sn63/Pb37 alloy, 15 - 25 microns (T5). I need to print with a 4.8 mil stencil opening. Does anyone know where I can get 250 to 500 grams in one week or less?

  1 2 3 4 Next

4,8 searches for Companies, Equipment, Machines, Suppliers & Information