Electronics Forum: 4.5 mm (Page 1 of 4)

Baking Moisture Sensitive Components >4.5mm

Electronics Forum | Mon Jan 22 14:22:46 EST 2007 | muse95

Actually, I've been looking into this myself, and the B version doesn't help any more than the A version. The tables still only go to 4.5mm. And Appendix B has a bunch of formulas with undefined variables that I haven't been able to figure out. An

SRT -1000 BGA rework system

Electronics Forum | Wed Jul 30 23:16:01 EDT 2003 | praveen

The profile is enclosed.The PBGA is 37x37 mm.I am keeping the gap about 4-5 mm.The profile meets the solder paste spec.Peak temp is 211 deg C,Above melting point 77 sec. rate of heating

MY DATA HYDRA TOOL LENGTH EROR

Electronics Forum | Mon Aug 19 16:42:07 EDT 2013 | thanh567

W- HTLM-5 :Hydra tool length wrong for tool tube 3. expected tool length 4.5mm, tool length found -1.358mm any one out there know what to look for this issue? sensor?

Baking components at 70 degree

Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla

We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n

Baking Moisture Sensitive Components >4.5mm

Electronics Forum | Thu Jan 18 21:45:34 EST 2007 | davef

Take this chance to update your documentation. See Appendix B in: http://www.jedec.org/DOWNLOAD/search/jstd033b.pdf How much fun is that going to be? As an alternative, maybe your supplier can save you the pain.

Baking Moisture Sensitive Components >4.5mm

Electronics Forum | Wed Jan 17 11:30:23 EST 2007 | Colleen Miller

We have some larger MSL3 parts that require baking. they are 6mm thick which takes them off the chart provided at http://www.jedec.org/download/search/jstd033a.pdf Does anyone have a reference that would tell me the baking times for these component

Baking Moisture Sensitive Components >4.5mm

Electronics Forum | Mon Jan 22 16:41:21 EST 2007 | davef

Contact: * JC-14.1 Subcommittee on Reliability; Chair: Jack McCullen, Intel; jack.t.mccullen@intel.com 480-554-5354 * Rich Shook, Brian Vaccaro, and Brian Pottieger - Agere Systems [ http://www.agere.com ] * Francois Monette; Cogiscan Inc.; 450-534-2

Black stain... what causes it?

Electronics Forum | Fri Jan 25 14:20:31 EST 2013 | jorge_quijano

Hi there, I have a new product today, after reflow oven I've seen a black stain coming from various holes, they can be cleaned with a tissue but some of the contaminant remains inside, we are using Sn63Pb37, the stains are far from soldering areas, t

H49s crystals been placed

Electronics Forum | Tue Jul 30 15:04:54 EDT 2013 | ericrr

Is it just possible that H49s crysats are hard to place, so it looks like it has been place by a perfectionistic instead of looked like it had a parachute type loading. This is the H49 short stubby type crystal about 10 mm long (width) about 4.5 mm

SOLDER BALLS

Electronics Forum | Tue Apr 28 21:48:50 EDT 2009 | davef

Confirm the source of the issue. Run a coalescence test on both lots of paste. A simple coalescence test can quickly determine the condition of solder paste after prolonged use. Simply print a small disk [around 4-5mm diameter and 0.2mm thick - a bu

  1 2 3 4 Next

4.5 mm searches for Companies, Equipment, Machines, Suppliers & Information

Online Equipment Auction of Altronic: Small-Batch Surface Mount & Assembly Facility

Reflow Soldering 101 Training Course
PCB Handling with CE

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
SMT feeders

Training online, at your facility, or at one of our worldwide training centers"