Electronics Forum | Thu May 25 21:50:27 EDT 2000 | Dave F
Bill: I'd expect better gasketing on a nice flat solder mask surface rather than the edge of the stencil opening mashed down on a irregular shaped hunk of solder attached to a pad. Stop thinking and get printing Dave F
Electronics Forum | Thu May 14 15:23:49 EDT 1998 | Matthias Mansfeld
Does anybody know a (if possible low-cost) system which can travel with the PWBs through a reflov oven (like some temperature profile loggers) for measuring the residual oxygen? My problem is, it is a batch oven which does not allow to have any pi
Electronics Forum | Tue May 26 20:24:39 EDT 1998 | Dave F
| Does anybody know a (if possible low-cost) system | which can travel with the PWBs through a reflov oven | (like some temperature profile loggers) for measuring | the residual oxygen? My problem is, it is a batch oven | which does not allow to h
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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