Electronics Forum | Fri Sep 14 19:06:09 EDT 2001 | slthomas
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Electronics Forum | Thu Apr 20 00:53:23 EDT 2000 | Wister
Hi,Dave The "skip" wouldn't happened because we monitor the solder paste height every two hours.The open position is between chip terminal and the solder paste.one terminal lift a little not as same as tombstone.I suspect the activity of solder paste
Electronics Forum | Wed Aug 08 04:00:46 EDT 2001 | jackt
Folks, I 'm in progress of generating the DFM checklist for New Product Introduction on PCA. I need some reference articles to prepare it apart from IPC-SM-782 (surface mont design and land pattern standard)that I'm using now. Any idea of extracti
Electronics Forum | Wed Aug 08 21:24:52 EDT 2001 | davef
First, not that it�s bad, but SM-782, the land pattern standard is a pretty far distance from a DFM check list. Now, if you�d said D-275 er more properly 222X, ama be twitchin� less. Second, your process should include two distinct elements: 1 Data
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