Electronics Forum: 5-2 (Page 1 of 7)

component aherence force on the solder paste before reflow

Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef

We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which

Special process validation - 7.5.2 - Soldering

Electronics Forum | Thu Dec 22 06:46:01 EST 2011 | rameshraja

Dear All, We are doing PCBA's manufacturing,Inprocess we are doing manual soldering, reflow and wave soldering process, As per ISO-7.5.2 Process validation ( Special process ) Soldering process is considered as an special process, hence in order to

QFP IC open solder

Electronics Forum | Sun Sep 22 09:36:04 EDT 2002 | davef

Sometimes the cut end of QFP leads have corrosion that is very difficult to solder. If this is what you're talking about, it is not a defect according A-610C, 6.5.2, Exposed Basis Metal

Solder Ball Criteria

Electronics Forum | Mon Mar 23 17:14:55 EDT 2009 | blnorman

That's one of the old IPC-A-610 revs. The latest, Rev D removed the size allowables and put in a general criteria statement(section

VCD 8 6241 loosing 5 volts supply

Electronics Forum | Wed Feb 03 18:29:46 EST 2010 | mika

4.85 V - 5.2 Volts. That is on the computer power inlet, Not the on the power supply. /Best Regards

Special process validation - 7.5.2 - Soldering

Electronics Forum | Mon Jul 15 11:36:18 EDT 2013 | rgduval

Some great legal language here, Dave. Guess some people don't like their knowledge being shared. Probably shouldn't publish it to the interwebs if that's the case.

Electrical Test problem

Electronics Forum | Thu Jan 18 17:26:30 EST 2018 | davef

I'm aware of no electrical test for detecting voids and air bubbles. If someone was x-raying my boards and saw voids and air bubbles and they weren't happy about it, first thing I'd do is convince them that the boards a within standard. You know some

IPC-A-610B Section 5.0 Cleanliness

Electronics Forum | Tue Mar 16 20:29:27 EST 1999 | Bob Bartolotta

In Section 5.1 Flux Residues, 5.2 Particulate matter 5.3 Chlorides and Carbonates & White Residues, I am assuming that these boards have been through some type of cleaning step. Hot water, saponifier, air dryed and the pictures illustrate unacceptab

Re: MicroBGA printing problem

Electronics Forum | Mon Sep 20 17:46:21 EDT 1999 | Dave F

I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We are usi

Has anyone looked into Vacuum storage on moisture sensitive devi

Electronics Forum | Tue Aug 19 11:31:43 EDT 2003 | davef

JEDEC standard EIA/JEP124 Section 5.2.1 Packing Moisture-Sensitive Components has words to the effect: "...Partially or lightly evacuate the bag to reduce packaging bulk and heat seal the bag as close to the end as possible following the heat sealing

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