Electronics Forum | Tue Jul 04 20:31:21 EDT 2017 | davef
If you want in, 5-21h Bottom Termination Components (BTC) Task Group is in "Working Draft" revision from "A" to "B" of IPC-7093 - Design and Assembly Process Implementation for Bottom Termination SMT Components
Electronics Forum | Wed Oct 20 14:24:32 EDT 2004 | Steve Gregory
It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography
Electronics Forum | Wed Oct 20 14:44:24 EDT 2004 | Steve Gregory
It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography
Electronics Forum | Wed Nov 03 14:46:29 EST 2004 | dramos1
Hi Russ, Thanks for the reply. In IPC-A-610 Rev. C on section 5.2.9 {Mounting - Connectors] page 5-21 on the manual [January 2000], the acceptable class [1,2,3]listed 3 items. In order for the connector to be accepted, are all 3 items must be met? I
Electronics Forum | Tue Sep 08 20:32:55 EDT 2009 | juanv
Hi, This is the firstime that I'm working with a HP 3070 Series 3 ICT. We ran the first assemblies and I would like to know where could I find all the information about this first article run. Fist of all, I need to know how could I visualize at
Electronics Forum | Fri Jul 24 13:41:05 EDT 1998 | Bob Willis
Sorry guys have a look at this list of component weights and then work out the surface area of the lead/pad and then come back on the PLCC issue. Chip 0805���� 0.007g������ 2 Chip 1206���� 0.009g���� 2 Chip 1210���� 0.012g���� 2 SOT23���������0.008g�
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