Electronics Forum: 5.21 (Page 1 of 1)

IPC A-610 Moving from Rev E to Rev F

Electronics Forum | Tue Jul 04 20:31:21 EDT 2017 | davef

If you want in, 5-21h Bottom Termination Components (BTC) Task Group is in "Working Draft" revision from "A" to "B" of IPC-7093 - Design and Assembly Process Implementation for Bottom Termination SMT Components

X-Ray Criteria for BGA Solder Ball

Electronics Forum | Wed Oct 20 14:24:32 EDT 2004 | Steve Gregory

It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography

X-Ray Criteria for BGA Solder Ball

Electronics Forum | Wed Oct 20 14:44:24 EDT 2004 | Steve Gregory

It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 14:46:29 EST 2004 | dramos1

Hi Russ, Thanks for the reply. In IPC-A-610 Rev. C on section 5.2.9 {Mounting - Connectors] page 5-21 on the manual [January 2000], the acceptable class [1,2,3]listed 3 items. In order for the connector to be accepted, are all 3 items must be met? I

QSTATS at HP3070 Series 3

Electronics Forum | Tue Sep 08 20:32:55 EDT 2009 | juanv

Hi, This is the firstime that I'm working with a HP 3070 Series 3 ICT. We ran the first assemblies and I would like to know where could I find all the information about this first article run. Fist of all, I need to know how could I visualize at

Camtastic 2000

Electronics Forum | Fri Jan 05 23:29:04 EST 2024 | sarason

Run type regedit hit return Next Search for the program ProgramEx etc. This will find all the references to your program, Recreate these references on your new HD. So you find Say Key HKEY_USERSS-1-5-21-3984164810-525138215-3110626622-1000Software

Re: DOUBLE REFLOW WITH HEAVY WEIGHT PLCC PACKAGE

Electronics Forum | Fri Jul 24 13:41:05 EDT 1998 | Bob Willis

Sorry guys have a look at this list of component weights and then work out the surface area of the lead/pad and then come back on the PLCC issue. Chip 0805���� 0.007g������ 2 Chip 1206���� 0.009g���� 2 Chip 1210���� 0.012g���� 2 SOT23���������0.008g�

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