Electronics Forum: 50mm (Page 1 of 7)

LGA voiding

Electronics Forum | Thu Jan 02 22:09:15 EST 2020 | Zack

Hello, Can you give more detail on LGA parts in question? is 50 mm x 50 mm is overall size of the parts? What about pad pitch and how big is the pads individually? I assume that 50x50 mm is overall size. How about the stencil opening for the LGA pad

IPC-TM-650, does it apply?

Electronics Forum | Fri Feb 07 19:30:52 EST 2014 | staylorebad

TM-650 specifies a 50mm (2in) length of tape to be used for the test. What about areas that are smaller than 50mm? For example component pads surrounded by open areas are much smaller than that as are vias. If they pull off using the tape test would

LGA voiding

Electronics Forum | Fri Jan 03 10:32:42 EST 2020 | emeto

Zack, circles 36mil copper 35mil circle stencil aperture. Pitch is 80mil. Stencil is 5mil and apertures are spread 46mm under the 50mm component size. In my mind this might be too much paste. I am afraid that if I print 4mil I might get open joints

YesTech YTV-2000 Question

Electronics Forum | Mon Apr 05 09:33:42 EDT 2010 | flanz

Hello. I'm new to the group and would like to ask a question about a YTV-2000 that I have. Question is - Could someone explain why my Yestech 2000 has a hardtime with calibration? What happens is that I run calibration before I start a new board.

TSOP40 Lead pitch 0.50mm recommended aperture sizes?

Electronics Forum | Tue Mar 11 09:33:06 EST 2003 | davef

I'm wrong about the MPM AP. I got my model designation crossed-up and was thinking of an older unit. I apologize to MPM for for my unfair criticism of their product.

Reflow Pallet hardware

Electronics Forum | Wed May 25 06:31:46 EDT 2005 | ajaydoshi

We also want to use pallet method. How you work it out. We do have small PCB ( 30mm x 50 mm ) which have 0402 component & also micro BGA. Is it possible to make pallot for these component. thanks Ajay

Uneven solder reflow

Electronics Forum | Wed Jan 17 18:42:49 EST 2007 | Richard

I'm trying to get an even solder coating onto a retangular shaped ceramic substrate (5.0mm x1.83mm), but the solder tends to pool on the short side of the substrate.

LGA voiding

Electronics Forum | Tue Dec 31 11:48:36 EST 2019 | emeto

Hello experts, I have a 50mmx50mm LGA on a PCBA. I Would like to decrease voiding in these joints and I wanted to hear about your techniques to decrease voiding. Stencil is currently 5mil. SAC305. ENIG finish.

LGA voiding

Electronics Forum | Tue Jan 14 16:57:52 EST 2020 | emeto

Still considering going from 5mil to 4mil stencil. Concern is the 50mm part might have issues with contact on the outside rows.

Re: 8 mil placement, part Deaux!!

Electronics Forum | Fri Sep 11 16:52:00 EDT 1998 | Dave F

0.050" -> 50 mil -> 50 pitch 0.80 mm -> 0.032" -> 32 mil -> 32 pitch 0.64 mm -> 0.025" -> 25 mil -> 25 pitch 0.50 mm -> 0.020" -> 20 mil -> 20 pitch 0.40 mm -> 0.016" -> 16 mil -> 16 pitch 0.20 mm -> 0.012" -> 12 mil -> 12 pitch Dave F

  1 2 3 4 5 6 7 Next

50mm searches for Companies, Equipment, Machines, Suppliers & Information

SMT spare parts - Qinyi Electronics

Stencil Printing 101 Training Course
2024 Eptac IPC Certification Training Schedule

Software for SMT placement & AOI - Free Download.
thru hole soldering and selective soldering needs

Training online, at your facility, or at one of our worldwide training centers"
PCB Depanelizers

Low-cost, self-paced, online training on electronics manufacturing fundamentals