Electronics Forum | Thu Nov 29 17:30:07 EST 2001 | davef
You give no clue of what you want to write about. Let's try this: J-STD-001, 8.3.1 Particulate Matter says words to the effect of solder balls / splats shall be neither: * Loose or able to be dislodged during normal service � NOR * Violate minimu
Electronics Forum | Fri Dec 06 10:16:57 EST 2002 | davef
Bare board cleanliness is still primarily measured by resistivity of solvent extract (ROSE) using instruments such as Omegameters and Zero Ions. What is considered as "acceptable" cleanliness varies between specification and from company to company.
Electronics Forum | Tue Dec 17 17:47:49 EST 2002 | Tim Marc
Dave, I�m talking about the 75% vertical fill of solder IPC 6.3 criteria (B), and 6.3.1 Fig 6-5. I also referred to the annular ring of the Plated-Through-Hole, being coated with solder mask. Semantics, yes I did refer to the Plated-Through-Hole (Sup
Electronics Forum | Tue Feb 21 20:22:46 EST 2006 | mnguyen
Hi, I am having problem looking through IPC and finding according to ISO spec what should the paste height requirement vs stencil. EXAMPLE: The stencil is 5mils thick and according to the specs we have on paste height measurement the max height to be
Electronics Forum | Tue Mar 17 07:32:10 EDT 2009 | davef
Solder ball acceptance: IPC-A-610, 6.5.3.1 & 12.4.10. Solder balls: 5 ball system: * No more than 5 balls per square inch (100mm2) allowed * Solder balls can not be greater than 5 mil (0.005in) (100um) * Solder balls cannot be less than 5 mil (100um)
Electronics Forum | Wed Dec 20 10:44:31 EST 2017 | bobpan
The z-rod bellows on head 2 and head 3 are slightly bent. The machine will show you this error if the runout is over 6.5 mils. This is usually caused by too much z when picking parts out of a vib or tray feeder. The machine will probably run. I ha
Electronics Forum | Mon Jun 29 15:25:09 EDT 2020 | jmelson
Spoilt, OK, a good point in your message, what good is a machine with 15 mm component height capability if there are no feeders that support that tall a component! I hadn't thought about that aspect! (My Philips CSM84 is limited to 6.5 mm, and I r
Electronics Forum | Tue Mar 06 08:00:30 EST 2012 | acsscott
Thanks for your input. I heard about the component size from someone else as well. They said if the component is greater than 8.4mm, it will not load another component next to it on an adjacent head, which is only 16mm away. The PLCC6 LED's are 5
Electronics Forum | Fri May 01 18:01:04 EDT 1998 | Peter Soland
Has anyone experienced profile related microbridging under 0402 capacitors in the past. We use a Sn46Pb46Bi8 paste, 178 degree C L.T.. Double sided board, 2 per panel, 6.5" x 5", convection oven. Profile data; thermalcouples @ components showing 200
Electronics Forum | Fri May 01 22:32:38 EDT 1998 | Jon Medernach
A pad design shaped like Home Plate will eliminate the problem, You can get info from Create Group at Panasonic FA They have the patent on this style pad and the most experience working with the 0402 and now have qualified the 0201 Caps from Murata