Electronics Forum: 6.2 (Page 1 of 7)

IPC Standard for mechanical Hardware

Electronics Forum | Tue Apr 24 21:27:43 EDT 2007 | davef

IPC-A-610D, 6.2.2 Swaged Hardware � Flared Flange

MPM SPM 1996

Electronics Forum | Thu May 24 08:06:31 EDT 2007 | ck_the_flip

1996. At the time you had Windows 3.1, Windows95, and DOS 6.2. These are good starts.

CircuitCam 6.2.3.3 Report Error

Electronics Forum | kghadiya |

Tue Oct 13 16:09:06 EDT 2020

Re: Wires UNDER BGA?

Electronics Forum | Thu Oct 21 21:17:19 EDT 1999 | Jeff Ferry

Mark, A challenge for sure. I suggest you review two techniques for this type of rework\modification. The first method uses a special circuit track run out from under the BGA. See: Jumper Wires, BGA Components, Circuit, Track Method at http://www

Test Coupons & Scrap Pieces for Testing Alternative to Oven Baking - IPC TM 650 2.6 2.8

Electronics Forum | Wed Sep 22 21:15:44 EDT 2021 | djenkins62

Hello Everyone: Heat Can Be Very Damaging to Boards and well as extended oven time can cut into valuable production time. Steel Camel is testing ambient temperature drying to remove diffused and embedded moisture in PCBs. We are seeking scrap pie

Thickness of solder paste from stencil

Electronics Forum | Wed Apr 10 11:45:08 EDT 2002 | mwoodall

We measure the thickness of solder paste printed onto PCBs as a control of the printing process. Generally 6 thou stencils are used and give between 6.2 and 6.8 thou. What thicknesses do other users get? Cheers! Mark

Conductor or Trace Spacing

Electronics Forum | Wed Jul 06 20:40:40 EDT 2005 | davef

Voltage does not flow. Current flows as a result of a change in voltage. Current capacity of traces * Graph is IPC-2221 paragraph 6.2, Figure 6.4 * http://www.geocities.com/CapeCanaveral/Lab/9643/TraceWidth.htm

Voiding under BGA's

Electronics Forum | Mon May 09 14:36:49 EDT 2005 | driscolj

We've had similar problems with Indium 6.2 water soluble paste. We reduced our voiding by implementing a longer soak and lower peak temperature.

CAF

Electronics Forum | Tue Jul 25 08:46:50 EDT 2006 | GS

Hello all, I need to learn about Conductive Anodic Filament (CAF). All information about the phenomenon will be appreciated. About IPC TM-650 6-2-25 CAF Resistance Test, where could it be performed in European Lab ? Thanks in advance Regards....

QFN Recognotion Problem

Electronics Forum | Sun Mar 25 10:53:19 EDT 2007 | barney

Check with your UIC sales if your machine can be upgraded to UPS+ 6.2.2 sofware. They have upgraded the vision system so that it can process these kinds of parts.

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