Electronics Forum | Thu Oct 21 21:17:19 EDT 1999 | Jeff Ferry
Mark, A challenge for sure. I suggest you review two techniques for this type of rework\modification. The first method uses a special circuit track run out from under the BGA. See: Jumper Wires, BGA Components, Circuit, Track Method at http://www
Electronics Forum | Wed Apr 10 11:45:08 EDT 2002 | mwoodall
We measure the thickness of solder paste printed onto PCBs as a control of the printing process. Generally 6 thou stencils are used and give between 6.2 and 6.8 thou. What thicknesses do other users get? Cheers! Mark
Electronics Forum | Tue Jul 25 08:46:50 EDT 2006 | GS
Hello all, I need to learn about Conductive Anodic Filament (CAF). All information about the phenomenon will be appreciated. About IPC TM-650 6-2-25 CAF Resistance Test, where could it be performed in European Lab ? Thanks in advance Regards....