Electronics Forum | Thu Oct 21 21:17:19 EDT 1999 | Jeff Ferry
Mark, A challenge for sure. I suggest you review two techniques for this type of rework\modification. The first method uses a special circuit track run out from under the BGA. See: Jumper Wires, BGA Components, Circuit, Track Method at http://www
Electronics Forum | Wed Sep 22 21:15:44 EDT 2021 | djenkins62
Hello Everyone: Heat Can Be Very Damaging to Boards and well as extended oven time can cut into valuable production time. Steel Camel is testing ambient temperature drying to remove diffused and embedded moisture in PCBs. We are seeking scrap pie
Electronics Forum | Wed Apr 10 11:45:08 EDT 2002 | mwoodall
We measure the thickness of solder paste printed onto PCBs as a control of the printing process. Generally 6 thou stencils are used and give between 6.2 and 6.8 thou. What thicknesses do other users get? Cheers! Mark
Electronics Forum | Tue Jul 25 08:46:50 EDT 2006 | GS
Hello all, I need to learn about Conductive Anodic Filament (CAF). All information about the phenomenon will be appreciated. About IPC TM-650 6-2-25 CAF Resistance Test, where could it be performed in European Lab ? Thanks in advance Regards....