6.5

"6.5" search results in the Electronics Forums



85 results found for "6.5" in the Electronics Forums

Order by: Relevancy  | Date

Fuji CP6-5 Servo Z overflow?

Jun 19, 2006 | Hi, Our CP6-5 has a Z overflow error when trying to zero set. The table moves in X and Y and alm

HSP 4791 vs CP6-5

May 12, 1998 |

HSP 4791 vs CP6-5

May 12, 1998 |

HSP 4791 vs CP6-5

May 12, 1998 |

HSP 4791 vs CP6-5

May 29, 1998 |

LGA36 6.5 x 3.5 mm

Mar 24, 2007 |

LGA36 6.5 x 3.5 mm

Mar 24, 2007 |

LGA36 6.5 x 3.5 mm

Apr 6, 2007 |

LGA36 6.5 x 3.5 mm

Mar 24, 2007 |

LGA36 6.5 x 3.5 mm

Mar 25, 2007 |

LGA36 6.5 x 3.5 mm

Mar 30, 2007 |

LGA36 6.5 x 3.5 mm

Mar 31, 2007 |

LGA36 6.5 x 3.5 mm

Apr 1, 2007 |

LGA36 6.5 x 3.5 mm

Apr 6, 2007 |

LGA36 6.5 x 3.5 mm

Apr 6, 2007 |

LGA36 6.5 x 3.5 mm

Apr 15, 2007 |

LGA36 6.5 x 3.5 mm

Mar 23, 2007 |

LGA36 6.5 x 3.5 mm

Apr 6, 2007 |

LGA36 6.5 x 3.5 mm

Mar 24, 2007 |

LGA36 6.5 x 3.5 mm

Apr 5, 2007 |

LGA36 6.5 x 3.5 mm

Apr 21, 2007 |

LGA36 6.5 x 3.5 mm

Mar 24, 2007 |

LGA36 6.5 x 3.5 mm

Apr 12, 2007 |

Solder Ball under BGA

Apr 28, 2004 | Solder ball acceptability: IPC-A-610, 6.5.3.1 & 12.4.10

IONIC CLEANLINESS SPEC FOR BARE PWBs

Dec 9, 2002 | I have seen the 6.5 ug/sqin and we have a fab house using 6.4, but I have no definitive answer for t

QFP IC open solder

Sep 22, 2002 |

Stencil Rolls

Jun 13, 2005 | The Standard prize for the cleaning rolls is about RM30(US 6.5 dollar).That's too expensive already.

Leaded Wave Solder Set Up

Sep 25, 2008 | Best is 7 or 6.5D if you cant achieve 7. In fact this is the best angle for Leaded and Lead Free, so

Topaz X Head Optimization

Mar 15, 2012 | On your mount data it has to go 8,7,6,5,4,3,2,1 once it goes to a higher number then the previous it

Topaz Xll tall components

Dec 14, 2015 | Good Day for Everyone! TOPAZ XII can handle 6.5mm height components easily. Is it possible to mou

No Clean flux with more solids

Mar 7, 2017 | Thank you bruce! I tried similar rosin based 6.5% but it gives me a lot of residue. Anything water b

LGA Processing

Mar 30, 2007 | Question: Does this formula apply even for the small LGA:s like LGA36 6.5 x 3.5 x 0.6 mm pad size 0.

Substrate Au/Ni thickness

Feb 15, 2001 | 0.5um(Ni~6.5um) after reflow(data taken in 48hrs).But after performing temperature cycle test ,the f

room for SMT

Feb 28, 2004 |

Solder balls under LLP

Aug 26, 2005 |

Stencil Design

Jun 3, 2009 |

screen thickness

Jan 23, 2012 |

Pick n Place tape dot

Feb 25, 2014 |

Accidental solder mask

Dec 17, 2002 | Dave, I�m talking about the 75% vertical fill of solder IPC 6.3 criteria (B), and 6.3.1 Fig 6-5. I a

Stencil past height issue

Feb 21, 2006 |

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