Electronics Forum: 6092 (Page 1 of 4)

SMT fuse clips

Electronics Forum | Tue Apr 24 08:20:29 EDT 2007 | esoderbe

For the automotive minifuse we use the Zierick 6092 fuseclip that requires their model 9700 for installation. They do have a surf shooter that can place the fuse directly onto the board but the engineering time to mate their machine to your SMT platf

Tombstone defect

Electronics Forum | Sat May 03 00:58:51 EDT 2003 | ken

Did you check if the height of solder mask between two pads is higher than pads?

Tombstone defect

Electronics Forum | Sun May 04 22:10:20 EDT 2003 | Thomas

Did u ever try a anti-tombstone solder paste to try to eliminate this problem ??

Tombstone defect

Electronics Forum | Tue May 06 06:31:21 EDT 2003 | yukim

The stencil thickness was about 7 mils and was changed to 6 mils.

Tombstone defect

Electronics Forum | Tue May 06 10:00:06 EDT 2003 | k_h

Got it, thanks, I've always used english mils. Have you solved the problem yet yukim?

Tombstone defect

Electronics Forum | Wed May 07 09:24:33 EDT 2003 | davef

Kris The majority of our tombstoning in very small passive SMT is caused by imperfections in end-cap solderability protection plating.

Tombstone defect

Electronics Forum | Fri May 30 11:24:45 EDT 2003 | dsuraski

We also use microns to describe solder paste powder particle sizes.

Tombstone defect

Electronics Forum | Fri Apr 25 08:48:25 EDT 2003 | davef

If what you say is accurate, two thing come to mind: * Pads on the board are incorrect for the tombstoning components. * Profile is different on the individual pads of tombstoning components. We have heard of, but never seen, components [tants] that

Tombstone defect

Electronics Forum | Thu May 01 17:49:33 EDT 2003 | jym2000

Did you check board orientation into the reflow oven? (The Layout components are the same products A & B?) Regards Jesus

Tombstone defect

Electronics Forum | Mon May 05 02:37:11 EDT 2003 | gaoliangcheng

Maybe you can check the thickness of the solder mask between the pads. If the highest of the solder mask exceed the pad,then the component which was placed will be unbalanced.

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