Electronics Forum | Tue Apr 24 08:20:29 EDT 2007 | esoderbe
For the automotive minifuse we use the Zierick 6092 fuseclip that requires their model 9700 for installation. They do have a surf shooter that can place the fuse directly onto the board but the engineering time to mate their machine to your SMT platf
Electronics Forum | Sat May 03 00:58:51 EDT 2003 | ken
Did you check if the height of solder mask between two pads is higher than pads?
Electronics Forum | Sun May 04 22:10:20 EDT 2003 | Thomas
Did u ever try a anti-tombstone solder paste to try to eliminate this problem ??
Electronics Forum | Tue May 06 06:31:21 EDT 2003 | yukim
The stencil thickness was about 7 mils and was changed to 6 mils.
Electronics Forum | Tue May 06 10:00:06 EDT 2003 | k_h
Got it, thanks, I've always used english mils. Have you solved the problem yet yukim?
Electronics Forum | Wed May 07 09:24:33 EDT 2003 | davef
Kris The majority of our tombstoning in very small passive SMT is caused by imperfections in end-cap solderability protection plating.
Electronics Forum | Fri May 30 11:24:45 EDT 2003 | dsuraski
We also use microns to describe solder paste powder particle sizes.
Electronics Forum | Fri Apr 25 08:48:25 EDT 2003 | davef
If what you say is accurate, two thing come to mind: * Pads on the board are incorrect for the tombstoning components. * Profile is different on the individual pads of tombstoning components. We have heard of, but never seen, components [tants] that
Electronics Forum | Thu May 01 17:49:33 EDT 2003 | jym2000
Did you check board orientation into the reflow oven? (The Layout components are the same products A & B?) Regards Jesus
Electronics Forum | Mon May 05 02:37:11 EDT 2003 | gaoliangcheng
Maybe you can check the thickness of the solder mask between the pads. If the highest of the solder mask exceed the pad,then the component which was placed will be unbalanced.
