Electronics Forum: 610c (Page 1 of 4)

SMT adhesive printing

Electronics Forum | Wed Dec 15 12:41:49 EST 2004 | DasonC

Check IPC-A-610C Chapter 12.1, Staking Adhesive

Leaching

Electronics Forum | Sat Apr 26 01:27:33 EDT 2003 | Iman

no S**t, I was going into SMTnet to post a question, on : 1) what is the actual "physics" behind "Leaching" defect? what is the accurate desciption to define this defect? how to eliminate the general causes to this defect? If encounter, what work pr

Re: Question on J-STD-001B

Electronics Forum | Sat Mar 18 06:51:38 EST 2000 | Dave F

Ashok: I believe J-STD-033 was released in the past year. A-610B is much older than that maybe 5 years. A-610C, �3.4.1 references J-STD-033. Ta. Dave F

Re: Question on J-STD-001B

Electronics Forum | Sat Mar 18 06:51:38 EST 2000 | Dave F

Ashok: I believe J-STD-033 was released in the past year. A-610B is much older than that maybe 5 years. A-610C, �3.4.1 references J-STD-033. Ta. Dave F

Through Hole Reflow

Electronics Forum | Wed Nov 28 12:33:01 EST 2001 | tonkowa

Did you have any luck in finding an acceptance criteria that QA accepted? We have had excellent results on signal pins of D-sunb connectors but the grounding prongs dod not meet IPC standard 610C, 4.3 Thanks, John

Press-Fit Workmanship standard

Electronics Forum | Wed May 16 14:09:22 EDT 2001 | davef

First thing I'd use is IPC-A-610C, �4.8.2 Connector Pins - Press-Fit Pins. Does it work in your case?

Adhesive Printing Specification

Electronics Forum | Tue Jul 03 21:16:34 EDT 2001 | davef

No glue on solderable surfaces. Glue is centered between pads. Consider A-610C, "Acceptability Of Electronic Assemblies", para 12.

Tilted/Slant SMT Component Specs?

Electronics Forum | Tue Mar 26 23:26:35 EST 2002 | ianchan

Hi Guys, (Note: We are not talking about bill-board RES/CAP, we are talking about Z-axis slant/tilted RES/CAP with respect to the PCB pad Z-axis plane). 1) We ref through the IPC-A-610C specification "bible", and can not find a "chapter/verse" tha

QFP IC open solder

Electronics Forum | Sun Sep 22 09:36:04 EDT 2002 | davef

Sometimes the cut end of QFP leads have corrosion that is very difficult to solder. If this is what you're talking about, it is not a defect according A-610C, 6.5.2, Exposed Basis Metal

BGA voids

Electronics Forum | Wed Jan 15 23:32:36 EST 2003 | tinson

How about section 12.2.12 of IPC-A-610C? It doesn't include detailed description of root cause/effect but acceptance criteria.

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