Electronics Forum | Tue Aug 19 09:32:42 EDT 2003 | Hussman
Nitrogen cabinets work well if you already have nitro.
Electronics Forum | D Peter |
Tue Aug 19 14:39:09 EDT 2003
Electronics Forum | Tue Aug 19 14:41:27 EDT 2003 | D Peter
Good point, I don't know if it will pull moisture from the atmosphere without a dry nitrogen purge. There's another thing to find out. Thank you
Electronics Forum | Tue Aug 19 09:48:07 EDT 2003 | D Peter
No, we don't have nitro. We may go that way if we can't find decent data from anyone other than the food industry on vacuum drying. I'm just more comfortable with low water/O2 content by removal rather than displacement.
Electronics Forum | Tue Aug 19 11:31:43 EDT 2003 | davef
JEDEC standard EIA/JEP124 Section 5.2.1 Packing Moisture-Sensitive Components has words to the effect: "...Partially or lightly evacuate the bag to reduce packaging bulk and heat seal the bag as close to the end as possible following the heat sealing
Electronics Forum | Tue Aug 19 13:47:46 EDT 2003 | slthomas
What are you going to fill the chamber with when it needs to be opened? If you use air, will the evacuated components suck up any available moisture? I've never done anything like this with electronic components, but some of the more porous materi
Electronics Forum | Thu Jul 20 12:44:21 EDT 2000 | Ketan Bhatt
We have difficulty in placing a trimmer capacitor chip using our Philips CSM 84 VIII pick and place machine. This Trimmer capacitor is supplied by Murata and its partno is TZBX4P300BA110T00 and value is 4.7~30 pf. While trying to place the componen
Electronics Forum | Tue Aug 19 12:15:37 EDT 2003 | D Peter
Again, that is for packaging, rather than moisture removal or storage. Those guidlines are for several reasons, preventing low pressure outgassing or disassociation of the dessicants, damage to parts or wafer tray due to forces on the evacuated pack
Electronics Forum | Tue Aug 19 09:09:15 EDT 2003 | D Peter
After a few problems and time constraints on baking moisture sensitive devices, we are looking at solutions to storage rather than going after a rebaking solution. One thing that always bothered me about baking was the oxidation on the lead finish,
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