Electronics Forum: 7095b (Page 1 of 1)

Thermal Relief BGA footprint design - traces - reflow

Electronics Forum | Tue Jun 03 12:29:58 EDT 2008 | slthomas

We don't build anything with BGA yet so don't have this standard but IPC-7095B, Design and Assembly Process Implementation for BGAs would be a good place to start. I don't know for a fact that it contains info. that applies specifically to your iss


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