Electronics Forum: 9.7 (Page 1 of 1)

Minimizing Board Warpage During Reflow

Electronics Forum | Tue Jun 02 20:26:17 EDT 1998 | Anthony

Does anybody know if a contraption exists that will minimize a PCB's tendency to become slightly bent after reflow? We have a new product that we're planning to assemble in a couple of months. The board is 9.7" by 13.4" and it is imperitive that we

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Thu Mar 16 19:12:22 EDT 2017 | pzappella

Hi Rob, Thanks for the LED paper. I like the void area equations but I am puzzled, the paper did not say if the solder was a solder paste that would generate a lot of voids, or a fluxless preform or sinter material. The measured voiding level

Flux Conductivity

Electronics Forum | Tue Aug 13 20:58:06 EDT 2002 | davef

Peterson: Ionic flux residues when combined with moisture and a voltage differential can plate conductive �fingers� on the surface of a PCB, but that doesn�t sound like what�s going on here. Your NC flux should not be particularly conductive. For

Re: Minimizing Board Warpage During Reflow

Electronics Forum | Thu Jun 11 23:35:40 EDT 1998 | Scott McKee

| Does anybody know if a contraption exists that will minimize a PCB's tendency to become slightly bent after reflow? We have a new product that we're planning to assemble in a couple of months. The board is 9.7" by 13.4" and it is imperitive that

Solder not reflowing properly

Electronics Forum | Fri Aug 29 10:37:44 EDT 2008 | gdzuber

Very interesting problem because it shows how systemic this kind of problem can be. So many variables, right? Firstly, discussions here are similar to everyone's postings, but there are some different observations. The manufacturer��s profile, we t

Re: Minimizing Board Warpage During Reflow

Electronics Forum | Wed Jun 03 07:02:25 EDT 1998 | Earl Moon

| Does anybody know if a contraption exists that will minimize a PCB's tendency to become slightly bent after reflow? We have a new product that we're planning to assemble in a couple of months. The board is 9.7" by 13.4" and it is imperitive that

OSP and SIR

Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef

Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem

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