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Affect of Solder Mask on Heat Dissipation

Electronics Forum | Mon Feb 05 10:21:21 EST 2007 | davef

Thermal conductivity [W/m-�C] * Silver: 418 * Aluminum: 403 * Copper [rolled annealed]: 392 * Copper [electrodeposited]: 392 * Gold: 297 * Nickel: 90.7 * Tin: 73 * SAC: 73 * Castin: 57 * Pb37Sn63: 51 * Lead: 35 * Epoxy, phenolic: 25-75 * Conformal co

expired solder paste

Electronics Forum | Thu Apr 03 22:56:48 EDT 2008 | davef

Potential impacts of using expired solder paste are [University of Bolton]: * Changed paste rheology. Result: poor print quality * Loss of solvents. Result: reduced flux activity * Changed flux formulation. Result: More difficult to clean flux residu

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