Electronics Forum: ceramics packages (Page 1 of 9)

SMT packages that can solder inverted?

Electronics Forum | Wed Aug 20 10:27:25 EDT 2003 | Dan Gosselin

Do any of you guys have a list of parts that cannot survive hanging upside down during reflow soldering. As our board designs become increasingly dense and higher speed, we need to use all available pcb real estate. This means locating parts we hi


Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef

You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *


Electronics Forum | Wed Oct 25 10:33:08 EDT 2000 | Chris

I need to know the advantages or disavantages of a plastic or FR4/Flex based BGA over the ceramic based BGA. We have a BGA package we are going to have produced. Some want to have it made out of ceramic because they feel a ceramic package will be a


Electronics Forum | Thu Jan 06 09:01:53 EST 2005 | Indy

go to the web site of "Lamina Ceramics". They have proprietary packaging technology for LED packaging. Indy

Ceramic BGA Balls Move Post Assy

Electronics Forum | Wed Aug 15 19:55:46 EDT 2012 | hegemon

If you are doing X-Ray post place and pre-reflow you should be good. Look elsewhere. Check profile - full lead free or hybrid? Be sure you are acheiving the required reflow temps and TAL required for the solder paste too. Check for belt movement

Is there a cross section standard test method...

Electronics Forum | Wed Mar 26 09:19:20 EDT 2008 | nibirta

hi all...well i`m working in such a lab but we are working internally, and for our customers. But i can give you some prices from other labs. Cross section-one location is around: Solder Joint Integrity Std. sample plastic package $300.00 Shorts /

Solder ball specifications?

Electronics Forum | Thu Jan 24 19:57:40 EST 2002 | davef

Are there formalized standards for the properties of solder balls? No Get IPC-7095 �Design & Assembly Process Implementation for BGA's�. General comments about array package solder balls are: * Ceramic packages use harder solder, like 90/10. * Pla

solder balls

Electronics Forum | Fri Jul 20 17:09:10 EDT 2001 | davef

Circuits Assembly magazine 09/99 "Defluxing with Ultrasonics" by Les Hymes. [There's more but I can't find it right now. I'll add to this as I find the junk, er very nice stuff.] J-STD-001C states that its OK to use ultrasonics for cleaning so lon

Ceramic case resonators falling to pieces after reflow soldering.

Electronics Forum | Wed Aug 30 00:16:15 EDT 2000 | Craig

We are reflowing ceramic resonators and are finding their tops falling/popping off when handling the pcbs during final assy. The epoxy seems to be coming off the components base and adherring to the lid. The components are "RFM resonators", case type


Electronics Forum | Wed Feb 17 16:39:05 EST 1999 | 3D

What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same.

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