Electronics Forum | Fri May 30 04:20:59 EDT 2003 | Ben
Hi all I am facing the problem with reoworking CSP component for high frequency application boards. Our customer do not allow us to use tacky fluxes due to high frequency application and component has low standoff ,and the ball pad and ball size is
Electronics Forum | Wed Apr 05 02:26:50 EDT 2017 | soldertraining
Excellent document link you have shared. High Frequency signals reflected on circuit board, meaning that the impedance (dynamic resistance) varies with respect to the sending component. Multi PCB supports you starting immediately in the design phase.
Electronics Forum | Mon Jul 08 03:09:12 EDT 2002 | Benny
Hi all How can I find the technical paper or source of information about using No-clean flux with high frequency apllication. High frequency mean more than 2 GHz - 5 GHz. I heard from my colleague that No-clean flux residue on board effect to high
Electronics Forum | Wed Dec 09 07:48:23 EST 1998 | EFData
Does anybody out there have any special insights into utilizing no clean paste in high frequency RF applications? I would imagine there may be some issues with solder balls that would affect functional test (Earl, do you have something for me here?)