Electronics Forum: mid-chip solder balling (Page 1 of 214)

Solder balling under passives

Electronics Forum | Mon Sep 19 01:57:28 EDT 2016 | shriram

Hi guys, Problem: Mid chip solder balling. Component affected: 0603 caps only Defect is PCB specific (Meaning only one PCB is affected as the aperture is standard for that component). As a containment I'll give a home plate design for the compo

Solder balling under passives

Electronics Forum | Mon Sep 19 09:16:24 EDT 2016 | markhoch

Hi Shriram, Are you saying that there is a trace running between the pads for this 0603 capacitor? If so, this design may be causing a gasketing issue between the stencil and the PCB. The uneven height prevents the stencil from sitting flat on the PC

solder balling

Electronics Forum | Sat Aug 05 12:12:05 EDT 2000 | Ramon I Garcia C

Hello Friends: I'm new in SMT process, I have a problem with little balls of solder beside of the component, I'm tried reducing the apertures in the stencil and making home base, some times the balls desappear, but some time not, and some times

Re: Micro solder balling

Electronics Forum | Fri Oct 27 08:59:17 EDT 2000 | Wolfgang Busko

Antonio: A lot has been said on this topic before. You might try the archives with "solder balling" and than check your process step by step ( you will find enough ) to find the cause of your problem. Any other advice would be repeating and repeating

Micro solder balling

Electronics Forum | Thu Oct 26 08:59:56 EDT 2000 | Antonio A. Medina

Ok guys, I need help. Here's the deal. We're getting micro solder balls under discreets on the bottomside of the board. Here's my set up... MPM screener w/vacuum plate 6 mil metal screen with 90% circular (rounded) apertures 7 mil (measured) past

Re: solder balling

Electronics Forum | Wed Aug 09 04:09:04 EDT 2000 | Jarno Py�ri�

Hello. I think, good stencil apertures is 80% from pad. And stencil thickness is 0.15mm - 0.20mm. I use 0.15mm thick stencil almost every pcb. Sorry my very bad english but i too learning. :)

Re: solder balling

Electronics Forum | Wed Aug 09 04:16:25 EDT 2000 | Jarno Py�ri�

And little more... If you use chip components, then that 80% from pads is good stencils apertures size. But if you use fine pitch components, example QFP, then you can use apertures, 90% from pads. I hoping that you understand something abou

Re: solder balling

Electronics Forum | Mon Aug 07 10:22:13 EDT 2000 | genglish

Ramon, I have had experience in the problems you are witnessing. The problem can relate to a number of factors. Obviously the printing process is the first place to start your investigations, try looking at the stencil apertures for bleed under the

Re: solder balling

Electronics Forum | Mon Aug 07 14:02:54 EDT 2000 | Brian W.

If you are satisfied with the apertures, then you need to check placement pressure, plant humidity, and the reflow profile. If the placement pressure is too great, it will separate minute portions of the solder from the pad. When the solder reflo

Re: solder balling

Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis

Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal

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