Electronics Forum: sem (Page 1 of 13)

DEK 265 vision alignment...

Electronics Forum | Fri Feb 14 08:08:47 EST 2003 | Louis

Louis Levert Electronique SEM

Cross Section Equipment

Electronics Forum | Thu Aug 19 10:20:27 EDT 2004 | Cal

DF-Indy: Are you thinking of a SEM as well?

Cross Section Equipment

Electronics Forum | Fri Aug 20 12:29:43 EDT 2004 | df_indy

Thanks for the input. We currently do not have plan for SEM.

Soldermask - sulfur presence

Electronics Forum | Mon Jun 25 03:52:24 EDT 2012 | awtm

Our Customer had detected tarnished pad on ImAg PCBA and had conducted several SEM-EDX test at the soldermask below some of the chip resistors. High concentration of sulfur was found and it can be significantly reduced after further chemical cleaned

contamination on feedthru wires

Electronics Forum | Mon Nov 13 11:31:10 EST 2000 | John Rep

I am having a problem with wetting on some feedthru wires. The problem seems to be contamination on the wires, due to the fact that the problem seems to be wire lot dependent. I have analysed it using SEM and come up with very little. Is there ano

Re: X-Ray Analysis service ???

Electronics Forum | Wed Oct 04 15:58:35 EDT 2000 | CAL

We are problem solvers for electronics industry and have analytical, Xray and SEM (Plus others) capabilities to help with BGAs. We can also use a scope to look under the component itself. All this and a report is possilbe on our side. Please contact

ARE ARE ANY REASION IN DELAMINATION OF SMD (QFP)EXCEPT HUMIDITY

Electronics Forum | Fri Aug 18 20:42:02 EDT 2000 | KYUNG SAM PARK

Hi. Smtguys I need help. The delamination of smd (QFP) occured when we checked with the SEM. This device have been excursed smt process after baking for 24 hour (125��) in oven. Are there any other reasion in SMD delamination except humidit

oven resin from adhesives

Electronics Forum | Mon Aug 19 04:48:27 EDT 2002 | surachai

I'm not found this problem with adhesive but found in NC flux , Then you should get some residue and analyse it by SEM and EDX for specify the actual source ( flux or adhesive ? ) , if it 's from adhesive , sometime your supplier must join this pro

Solder Joint Microstructure

Electronics Forum | Thu May 01 17:25:10 EDT 2003 | davef

Our first choice in determining the composition of metals would be to use Scanning Electron Microscopy (SEM) / Energy Dispersive Spectroscopy (EDS) analysis.

Silicon contamination in solder joint

Electronics Forum | Wed May 28 11:56:18 EDT 2003 | blnorman

Yes we are using "silicones", but to find this contaminant we were looking for "silicon" the element by SEM/EDS. We use Dow materials and my contact there is checking to see if they have any info.

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