Electronics Forum: snagcu (Page 1 of 5)

Lead Finish

Electronics Forum | Tue Apr 05 07:46:47 EDT 2005 | py

lead free plating can create whiskers. you might use dim sn/ag/cu .

Pb-Free solder alloying with finish on components

Electronics Forum | Tue Aug 22 09:49:39 EDT 2000 | galltp

Dr. Lee, We have seen a small decrease in shear strength for Pb/Sn plated components attached with Sn/Ag/Cu solder compared to components with a Pb-free finish. With the jump in the cost of Pd, we are struggling to define a practical Pb-free

Lead Free Process

Electronics Forum | Thu Jun 21 00:23:55 EDT 2001 | Robert Sykoh

Hi, I am looking into lead free process. Do anybody has experience?? The composition used in SMT & wave. I heard Sn,Ag,Cu & Sn,Ag,Cu,Bi. What are the major differences and concerns. Besides, what are the capital investment required?? Any advice is

Lead free solder paste selection

Electronics Forum | Thu Jul 01 17:35:30 EDT 2004 | Sofia

Hi Everyone, I am just curious, is there a guidline that people follow for choosing their lead-free solder paste? In other words, how do people know whether they should use Indium alloy, or Castin (Sn/Ag/Cu), or whatever else? Thanks

Sn/Pb paste with SAC plating

Electronics Forum | Thu Oct 21 16:31:23 EDT 2004 | Tony

I have a component manufacturer that is using Sn/Ag/Cu plating on chip caps and resistors. Does anyone have any information on compatability with Sn/Pb paste. Are any changes in profile required? Is the reliability of the solder joint at risk? Tony

Hybrid reflow profile

Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef

Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.

Lead Free Sn-8Zn-3Bi Solder Paste

Electronics Forum | Tue Oct 05 10:38:43 EDT 2004 | palmerg

Major Japanese OEMs investigated numerous lead-free alternatives, including alloys containing bismuth and/or zinc, such as Sn/Ag/Bi/Cu, Sn/8Zn/3Bi and Sn/58Bi. However, over time, the Japanese industry has moved toward Sn/Ag/Cu alloys. The Japan Elec

lead free components in leaded process

Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel

D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.

Tombstone defect

Electronics Forum | Wed May 07 09:02:17 EDT 2003 | Kris

Hi SnAg is a binary alloy and does not have the same effect as a ternary SnAgCu alloy as far the pasty range is concerned. But then paste only can do so much. The best way to do it is to have proper pad design, controlled placement and reflow. I w

Palladium Silver surface finish

Electronics Forum | Tue Aug 24 13:45:17 EDT 2004 | Indy

Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th

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