Electronics Forum: a230 (Page 1 of 1)

Low standoff components, flux removal

Electronics Forum | Thu Sep 01 12:07:35 EDT 2016 | pavel_murtishev

Is there any field proven spray cleaning technique able to remove flux residues under OSRAM LEDs? Is it possible in principle? The problem is that OSRAM LEDs are low standoff ones and I absolutely have no idea how cleaning agent could get there. Mo

Prototype SMT & Ltd Prod Line Choices & Advice

Electronics Forum | Thu Mar 13 16:32:25 EDT 2008 | dyoungquist

MyData PNP machines are good for high mix/low volume because change over time between jobs is lower than with many other PNP machines. They also handle parts on cut tape strips easily and you will have these with low volume runs. As for lead free o

Reflow PBGA

Electronics Forum | Wed Jun 26 00:49:52 EDT 2002 | ianchan

Steve, I'd second Daan's opinion. BGA profile we use gets a peak of 210deg-C to 223deg-C (but that's using our WS paste unique characteristics) with reflow zone holding time of 45-60sec. We had 6 PBGA and 2 ceramic BGA on a 6 layer PCB. typical p

Question about leaded parts used in leadfree soldering process

Electronics Forum | Thu Apr 20 22:46:26 EDT 2006 | samir

Amol, I thought I answered your question in another thread, dude! Anyway, to re-iterate. Yes, I was able to pull it off a hybrid profile. The LF BGA passed tensile testing, but no, it wasn't thermally cycled or stressed first to expose any latent

Use lead-free alloy wire during rework for Leaded Process

Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef

What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC

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