Electronics Forum | Fri Jul 06 11:00:50 EDT 2007 | shrek
Krikies my friend. A good wave ogre will be able to look at a wave and tweak in a way to minimize contact length (by slowing the conveyor speed), thus improving peelback, and lower it to the bare minimum without disrupting it's backward and forward
Electronics Forum | Mon Jul 09 11:59:25 EDT 2007 | sck1971
Does anyone have any industry standard yield factors to load at the component level to account for set up scrap and machine waste during production? I'm assuming there are different percentages used for each package size (0402, 0603, SOIC8, etc) but
Electronics Forum | Fri Jul 20 11:48:22 EDT 2007 | muse95
I agree with Chris. Not all but SOME components definitely had to change to be able to withstand higher heat. I would watch out for some plastic connectors, possibly some active components, and definitely many electrolytic caps. Older stock compone
Electronics Forum | Wed Jul 18 08:07:27 EDT 2007 | allgood
OK thanks - I wasnt aware that I HAD a small x motor! You mentioned being able to check in the service menu - would you care to point me in the right direction. What amazes me - or rather, worries me, is that repeated mentions to the Mydata service
Electronics Forum | Thu Aug 02 17:27:54 EDT 2007 | jmelson
This process is going to make conventional rework, and most mods and ECOs impossible. You might be able to make some changes by patching a component across the exposed pads, but most of the circuitry will be buried. You could, of course, make speci
Electronics Forum | Wed Aug 22 16:11:15 EDT 2007 | razor1
If the problem appears to be random... we had a similar problem. We found that the belt which feeds the PCB through the reflow oven would jump or lurch ahead. It was barley noticeable but if you have identified the frequency and time of the compone
Electronics Forum | Tue Aug 14 15:08:32 EDT 2007 | gmoritz
pick/place head won't travel over the LED's, then you won't be able to proceed. I wasn't clear in describing my board layout; It is LEDs on one side and SMT components on the other side. I don't think we can get around the problem of stenciling
Electronics Forum | Mon Aug 20 13:45:12 EDT 2007 | brulal1
We are low volume high mix, when we program the pick and place equipment we like to program and optimize several different PCB on the same set-up. We used to work with Panapro form Panasonic. I have and MSR, MPA 3F and Universal Advantis AX-72. Looki
Electronics Forum | Wed Aug 22 11:58:11 EDT 2007 | ev
Thanks for all responses really good feedback. I have placed a number of extra supports underneath each pcb in the panel and by checking each print diligently we seem to be able to keep running. Not feaseable at the moment to check out leaded paste o
Electronics Forum | Fri Aug 24 12:20:41 EDT 2007 | petep
I have an MSL3 part (a relay) supplied in tape and reel. From what I am able to determine, these parts require baking at 257 degrees F for a minimum of 8 hours once the integrity of the seal is broken for over 168 hours. How are parts baked at th
