Electronics Forum | Mon Aug 19 13:47:45 EDT 2019 | emeto
Forget about a stencil here. The only solution I have for you is to dispense this paste. There are some super cool Jet printers out there that will do the job.
Electronics Forum | Thu Aug 15 21:16:46 EDT 2019 | ameenullakhan
Hi Thanks, I am concern about Raw nitrogen purity level. When we receive it in our compony from a supplier. Regards, Ameen
Electronics Forum | Fri Aug 16 13:49:48 EDT 2019 | slthomas
Thanks Ed. I guess about all we can do is hope that the extreme nature of the flaw equals a higher degree of early detection. So far we haven't replaced any of these on RMA's so I guess that's a good sign.
Electronics Forum | Tue Sep 10 16:03:34 EDT 2019 | slthomas
If you are talking about a DIP package Hepco (www.hepcoblue.com) is advertised on this site for lead forming equipment (they do have a DIP trimmer) and Bomir can be found elsewhere.
Electronics Forum | Tue Oct 15 09:52:38 EDT 2019 | SMTA-Davandran
I seeing connector with butt (I) lead drop off after drop test conducted. the current shear force is about 3kgf. How can this problem improved.
Electronics Forum | Wed Oct 30 13:43:17 EDT 2019 | emeto
This should be fixed by someone who has access to Windows on these machines - probably ASM engineer. You are right to be worried about traceability. Also changing this time might lead to much more issues underneath, so don't just change it before ask
Electronics Forum | Mon Nov 04 07:27:33 EST 2019 | amitthepcbguy
There are multiple methods where you can perform top and bottom reflow soldering simultaneously. With this method, you might not worry about the type of flux there is. Each part is covered and baked as per the requirement, while making sure there are
Electronics Forum | Fri Nov 08 21:49:54 EST 2019 | elsey1987
hi How about this type? 630*530*570mm with 50slots How many pcs you may need
Electronics Forum | Tue Nov 26 09:07:16 EST 2019 | scotceltic
I am more worried about those voids also instead of the voids in the thermal pads. I still can't find any IPC spec that calls out a min. void percentage other than on BGA packages.
Electronics Forum | Mon Dec 02 20:05:25 EST 2019 | crystal12
personally, I do allow. usually, they will do some design for manufacturability change. this cannot be avoided. I have read an interesting article talking about this question, maybe you can check: http://www.starivergroup.com/News/info.aspx?itemid=10
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