Electronics Forum | Mon Oct 04 11:23:55 EDT 1999 | Mark D.
Does anyone have a list of component types that can be put on the bottomside of a doublesided reflow board that will not fall off during the second pass (Or on the otherhand, a list of components that will fall off)? This would be a list of parts tha
Electronics Forum | Wed Sep 29 04:33:35 EDT 1999 | Earl Moon
| | Hi All, | | Any one experince BGA-chipset warp about 10-15mil after removing | | from PCB? | | FYI, the rework temperature for preheat was 170C from room | | temperature about 30 seconds, & BGA was removed at temperature | | between 190-200C.
Electronics Forum | Thu Sep 23 13:47:14 EDT 1999 | Terry Burnette
| | I need know the types, characteristic specials for temperature, general characteristics and all I need know about of manufacturer for BGA. | | | | I Hope than you send my information about this. | | | | | Try this Link http://mot-sp
Electronics Forum | Wed Sep 22 03:23:40 EDT 1999 | Jeanjean
Dear all, First, I'd like to thank every one of you who have been a great help for my last questions. Then, I have heard that in multilayer ceramic capacitors, each layer of ceramic was about 3 micrometers at least. When adding the layer (which I d
Electronics Forum | Mon Sep 20 08:21:52 EDT 1999 | Mohammed saad
Hi all, We have a little discussion here about the suitable flux for a certain process, as all of us are beginners we need your advice. We are producing VGA cards and mother boards for PC's all components to be wave soldered are TH, the SMD is done
Electronics Forum | Wed Sep 08 13:36:27 EDT 1999 | Wolfgang Busko
| Hello: | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into the oven. When
Electronics Forum | Wed Sep 08 14:31:48 EDT 1999 | John Thorup
| | Hello: | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into the oven.
Electronics Forum | Mon Aug 09 16:37:14 EDT 1999 | John Thorup
| Just curious what effect pinholes and solder voids can have on solder joints that have high current passing thru them. Also could moisture from steam sterilization (autoclaving) get inside a said solder joint and then outgas during high current, an
Electronics Forum | Tue Jul 27 16:08:04 EDT 1999 | Kathleen at ATL
I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the perime
Electronics Forum | Tue Jul 27 11:59:19 EDT 1999 | Wolfgang Busko
While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That would m
