Electronics Forum: about (Page 386 of 1194)

Market Research

Electronics Forum | Tue May 30 08:24:23 EDT 2000 | David Lazarus

Could some of you give me ideas where I could find articles or studies about market or player performance in the SMT/through hole industry (specifically, OEM's for the automotive industry)? I am part of design team for a scholastic design project at

RE: PROBLEMS IN FUJI MACHINE (FCP-III)

Electronics Forum | Sat May 27 14:09:23 EDT 2000 | do ngoc hung

MAY YOU HELP ME TO SOVLE THE PROBLEMS IN MACHINE. I CAN NOT CHECK NOZZLES IN CENTER, BRIGHTNESS MODE OR THE CCD CAMERA CAN NOT CAPTURE THE NOZZLES. SO MAY I HAVE ANY INFO ABOUT IT. PLS GIVE ME A ADVICE ASAP VIA EMAIL. THANKS AND BEST REGARDS. DO

intrusive reflow with OA paste

Electronics Forum | Tue May 23 22:23:20 EDT 2000 | JAK

Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e

Re: intrusive reflow with OA paste

Electronics Forum | Wed May 24 11:21:32 EDT 2000 | Travis Slaughter

Its my understanding that so long as the paste is not exposed to air it is not going to be active, someone else might be more sure about this than I am. Be ready for lots of half soldered leads using this process. Its quick and easy but will not b

intrusive reflow with OA paste

Electronics Forum | Tue May 23 22:21:13 EDT 2000 | JAK

Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e

Re: Operating a SMT system

Electronics Forum | Wed May 17 21:13:00 EDT 2000 | Dave F

Earl: Two things: 1 You know that I read your articles, because I asked you questions about them and e-mailed you a drawing of a layer stack. 2 You certainly rose to JAXs bait. I believe he may have set the container on the table, while removing

Re: UniCam Forum

Electronics Forum | Mon May 15 18:06:02 EDT 2000 | Micah Newcomb

Mark, I am not aware of any forum dedicated soley to Unicam, but as Jax said this forum is about as good as any. I am sure there are many Smtneters that use Unicam daily, myself included. We use Unidoc for documentation and we also utilize Fuj

Re: Stacking chips

Electronics Forum | Fri May 12 10:17:54 EDT 2000 | Wolfgang Busko

Hi Ashok, you may look through the archive for "patches - Wolfgang Busko 09:57:37 11/12/1999" it�s exact the same subject. Do you have the newest IPC-standart Jeff is talking about in that thread ? What�s the reason for this measure, component-sho

Hybrid solder balls

Electronics Forum | Fri May 12 07:32:13 EDT 2000 | David Hatherall

Help. We are about to start a project to test the suitability of attaching a ceramic thick film hybrid to a pcb using solder balls. we have no previous experience of this technique and would like a few pointers in the right direction.. eg recommend

Re: 0201Technology

Electronics Forum | Fri May 12 05:47:18 EDT 2000 | Wolfgang Busko

Just another thing to look at: Look in the archives of IPCs technet. There I found this interesting this interesting link http://www.plexus.com/In_The_News/Papers/papers.html and an interesting article (in PDF format) about "tombstoning of 0402's a


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