Electronics Forum | Thu Apr 28 11:14:27 EDT 2005 | bbarr
If you apply the RTV after coating, what happens to bond strength since you are now bonding to the coating and not the board? Will the caps still survive vibration and shock? I specify applying RTV before coating for this reason. Am I correct? I als
Electronics Forum | Sat Apr 23 19:31:25 EDT 2005 | molosse21
Hi, Is there a solder paste alloy espacially done to solder components on a pcb gold plated ??? I am using the AIM 297DX SN63/PB37 no clean and i had a comments from my customer telling me that i am not using the right alloy. Personally i never he
Electronics Forum | Sun Apr 24 09:12:00 EDT 2005 | davef
We're not sure what your customer is talking about either. Gold and tin form an intermetallic compound [IMC] that can cause poor solder connections. To minimize the potential of a problem, keep gold to less than 3 percent of the metal. [Search the
Electronics Forum | Sun May 29 15:12:46 EDT 2005 | Philippe
I have been following this thread with a great interest. However, the rules or legislations that control RoHS standards is maybe questionable, but I can't see why people/companys have so hard to think about the "next generation"? The fact is: RoHS is
Electronics Forum | Tue Apr 26 16:56:23 EDT 2005 | stepheniii
Is anyone using any NanoStar components from TI? It looks like we might be building boards with some soon. We have put down 0201's successfully. But these are a whole other ballgame. They are 0.9mm by 1.4mm with 5 or 6 balls on the bottom. Would thi
Electronics Forum | Wed Apr 27 07:16:40 EDT 2005 | jdumont
Thanks a lot guys. The part dims are in mm by the way. So last night i was looking at the .pcb file and saw that the pad size and stencil are both .013" while the ball on the BGA is .018" (sorry for switching from metric). Is this ok or can i have en
Electronics Forum | Wed Apr 27 10:47:26 EDT 2005 | HOSS
A 1:1 pad to ball diameter will cause the balls to collapse more giving you less post solder component standoff. Depending on the application of this product and required reliability, you may want to stay with the padstack being used. You may try c
Electronics Forum | Wed Apr 27 13:49:11 EDT 2005 | Shean Dalton
Hi Sarag, We share Sara's described experience with cleaning No-Clean/Low Residue flux residues. We can add that of the Low Residue residues, Indium SMQ92J is one of the more challenging flux residues to clean. That said, we have had repeated succ
Electronics Forum | Mon May 02 10:18:30 EDT 2005 | Frank
Juki KE-2050R (or any of their R-series machines). They have the ability to automatically learn pick positions on paper tape feeders and they can zoom in on pick locations (x2 or x4), so this will help when they release their nozzle for 01005 compon
Electronics Forum | Wed May 04 04:31:44 EDT 2005 | siverts
What is the MS-level and floor life of the critical components (should be written on the MSD-bag)? What is Your climate condition in the production area (%RH, temp.)? Are you doing this inspection on every board or is it enough to do it on the first
