Electronics Forum | Sun Sep 12 10:51:04 EDT 1999 | K.T
| | | | | | | Hello: | | | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before put
Electronics Forum | Thu Aug 19 14:06:07 EDT 1999 | Stu Leech
| | | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large sca
Electronics Forum | Tue Jul 27 16:22:17 EDT 1999 | Earl Moon
| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the
Electronics Forum | Wed Jul 28 20:14:22 EDT 1999 | Dave F
| While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That would
Electronics Forum | Tue Jul 27 11:32:01 EDT 1999 | M.L.
| | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | 12BGA per assembly | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | Pads .014inch | | Vias within footprint .020inch | | Vias to be filled by bottom side(solder side) only
Electronics Forum | Wed Jul 28 16:48:13 EDT 1999 | Earl Moon
| | Yeh Dan, | | | Bought one of those DEK/Universal 265's awhile back. Swear it went faster with their name on it. Never done AMI. What's it all about? | | | Earl Moon | | Hello Earl! | | I have spoken to AMI a couple times while trying to do so
Electronics Forum | Tue Jul 13 07:57:27 EDT 1999 | Mark Quealy
| | | | I am looking for suppliers of ESD floor coverings. I currently have ESD carpet and I would like to replace them with ESD Tile. Help Me | | | | | | | | MD Cox | | | | | | | | Try a search in the archives. A while back someone asked for
Electronics Forum | Thu Jul 08 15:38:27 EDT 1999 | Earl Moon
| Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. |
Electronics Forum | Thu Jul 01 17:12:28 EDT 1999 | Earl Moon
| | | | | | | | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with
Electronics Forum | Fri Jun 18 13:48:37 EDT 1999 | Earl Moon
| We currently use HASL on all of our boards and I would like to move to something else. I have sampled some boards with Entek OSP and I loved it, the problem is we have plated mounting holes on just about every board we make. Does anyone have info
