Electronics Forum | Sun Jan 19 10:25:54 EST 2003 | davef
You shouldn't freak. You want the pads on both sides of the BGA ball the same so that the torgue from changes in dimension due to different CTE [ie, interposer, solder, bare board, etc.] is balanced on the top and the bottom of the ball. So, the ma
Electronics Forum | Mon Jan 27 09:43:15 EST 2003 | davef
Sorry. I mistyped information on the guidelines. It should be: SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments Order SM-785 from: IPC 2215 Sanders Rd Northbrook, IL 60062-6135 847-509-9700 When you are ordering t
Electronics Forum | Mon Jan 05 18:03:04 EST 2004 | davef
You may struggle finding the information that you seek, because there is so much variability in the design and fabrication of boards. * What is the purpose of such a test? * What product type sees such an use environment? Consider using the guidelin
Electronics Forum | Thu Apr 15 11:15:30 EDT 2004 | patrickbruneel
Pure (red) copper oxide is green, its not a residue its just oxidation. In your case water and heat will accelerate the oxidation process of unplated or unprotected pure copper. The best way to avoid this from happening is use a socket with tin or n
Electronics Forum | Fri Mar 02 15:01:32 EST 2007 | dyoungquist
We have a TP9 and are having no problems placing 0402s or fine pitch QFPs. Try slowing down the accelerations on the X and Y axis. That increases the time it takes to place a part but I have found that it can help accuracy. All the other posts hav
Electronics Forum | Mon Jun 25 12:23:15 EDT 2007 | davef
Once the HumiSeal conformal coating has been applied to the printed circuit board it is usually best to allow the material to reach a touch-dry stage, before heating the board to accelerate the cure schedule. This avoids potential problems such as bu
Electronics Forum | Mon Aug 13 12:03:50 EDT 2007 | davef
Test results indicated that the life of lead-free solder at a 2512 chip resistor could be worse than of SnPb solder in the accelerated thermal cycling condition. [Development of Life Prediction Model for Lead-free Solder at Chip Resistor, Changwoon H
Electronics Forum | Fri Feb 19 14:58:56 EST 2010 | patrickbruneel
I shared a consultation report on Toyota’s sudden acceleration problems made by Keith Armstrong for the US Government’s NHTSA. It just lists the lead free move as a possible cause, nothing more nothing less. And if Toyota wasn't completely lead free
Electronics Forum | Wed Jun 08 08:33:56 EDT 2011 | fredc
Unless you have a feeder with unusual vibration that is generated during the advance it seems that the issue is packaging. Try another feeder that has been tuned up and properly lubed. Most high speed turret machines move the feeders back and forth a
Electronics Forum | Fri Oct 11 17:10:36 EDT 2013 | hegemon
I think the critical item is that you are soldering in a reduced oxy environment, lowering the rate of ongoing oxidation. Heat accelerates oxidation, lack of oxygen (of course) slows it down. The 10 Nitrogen soldering "myths" seem to be more like "
