Electronics Forum: achieving (Page 1 of 68)

0201 feeders

Electronics Forum | Fri May 19 11:21:17 EDT 2006 | stepheniii

If you eat bacon with your eggs you will achieve maximum leverage with your thinking by achieving ultimate synergy from the nourishment.

Vacuum Soldering

Electronics Forum | Wed Jun 11 14:09:58 EDT 2014 | spitkis2

Is anyone running reflowing in a vacuum oven to achieve void free connections? If so, are there any issues you are experiencing with this process? What level / measurement of vacuum that you need to achieve for good results?

Solder Paste

Electronics Forum | Mon Sep 17 10:05:48 EDT 2001 | sallyt

From your experience, what are the properties of a solder paste that will achieve a high yield 0201 assembly process?

BGA Assembly

Electronics Forum | Wed May 29 11:11:16 EDT 2002 | jax

Are you using Diamond apertures to achieve a volumn you cannot get through round ap's?

Strain Gage Analysis tips

Electronics Forum | Thu Jul 17 05:59:50 EDT 2003 | scwalsall

We have started an initiative to eliminate component damage within our SMT area in order to achieve

how to achieve 500ppm?

Electronics Forum | Tue Jun 14 16:37:56 EDT 2005 | slthomas

You may be right. I may have read something into his post that wasn't there....

ITAR Certification

Electronics Forum | Thu Feb 24 14:39:16 EST 2011 | atiya124

Can someone explain the procedure to achieve the ITAR Certification.

Paste In Hole

Electronics Forum | Wed Jun 27 13:55:10 EDT 2001 | peterson

We are having some difficulty achieving 75% fill on some through-hole power connectors. The board is very thick. Any suggestions? Our plan is to preheat extensively, pre-tin the leads and perhaps add paste in hole. Anything else that might achieve th

Re: High temperature solder paste for gold plated MCMs

Electronics Forum | Thu Jan 27 14:16:14 EST 2000 | Tuan Bui

I've tried Indium NC-SMQ92(96.5Sn 3.5Ag) on these MCMs and achieved only marginal wetting on pads and parts. The good wetting is what I try to achieve, shiny is what my engineers want (Prototype environment). Does pre-cleaning the PWBs in ultrasonic

Immersion Gold

Electronics Forum | Thu Sep 30 10:30:11 EDT 1999 | Chris May

I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. What is the best way to achieve

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