Electronics Forum | Wed Jun 11 14:09:58 EDT 2014 | spitkis2
Is anyone running reflowing in a vacuum oven to achieve void free connections? If so, are there any issues you are experiencing with this process? What level / measurement of vacuum that you need to achieve for good results?
Electronics Forum | Wed Jun 27 13:55:10 EDT 2001 | peterson
We are having some difficulty achieving 75% fill on some through-hole power connectors. The board is very thick. Any suggestions? Our plan is to preheat extensively, pre-tin the leads and perhaps add paste in hole. Anything else that might achieve th
Electronics Forum | Thu Jan 27 14:16:14 EST 2000 | Tuan Bui
I've tried Indium NC-SMQ92(96.5Sn 3.5Ag) on these MCMs and achieved only marginal wetting on pads and parts. The good wetting is what I try to achieve, shiny is what my engineers want (Prototype environment). Does pre-cleaning the PWBs in ultrasonic
Electronics Forum | Thu Sep 30 10:30:11 EDT 1999 | Chris May
I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. What is the best way to achieve